Vapor Chamber Structure With Copper Interlayer Against Surface Ripples
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Solution Overview
Problem
Ripple formation on the surface of vapor chambers due to material differences with heatsinks during rapid temperature changes affects heat dissipation efficiency.
Innovation Solution
A vapor chamber design with staggered support structures and a copper plate interposed between the vapor chamber and heatsink to enhance stability and heat conduction, preventing ripple formation and improving heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a vapor chamber is directly coupled to a heatsink, then heat dissipation efficiency is improved, but surface ripples form during rapid temperature changes due to material differences
Solution Approach 1:
A copper plate is introduced as an intermediary component between the vapor chamber and the heatsink. This intermediate layer acts as a buffer that accommodates differential thermal expansion between the two components, preventing surface ripples while maintaining effective heat transfer. The copper plate's thermal and mechanical properties bridge the gap between the vapor chamber and heatsink, solving the contradiction between direct coupling benefits and thermal expansion mismatch.
2Stability of the object's composition
If support structures are added to prevent ripples, then surface stability is improved, but device complexity increases
Solution Approach 1:
The copper plate serves as a simple intermediary that inherently provides structural support and ripple prevention without requiring complex additional components. By placing this intermediate layer, the patent achieves surface stability through a straightforward design rather than complex support structures, thus resolving the contradiction between stability improvement and device complexity.
3Stability of the object's composition
If a copper plate is interposed between the vapor chamber and heatsink, then thermal stability is improved, but device complexity increases
Solution Approach 1:
The copper plate is a simple, single-component intermediary that provides thermal stability by buffering rapid temperature changes and accommodating thermal expansion. Rather than introducing a complex system, the patent uses this straightforward intermediate layer to achieve thermal stability, thus resolving the contradiction between improved thermal stability and increased device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency by 15-20% and ensures even heat distribution, preventing surface ripples and maintaining thermal stability during extreme temperature fluctuations.
Implementation Method 1
Vapor chambers are vacuum containers that transfer heat from a heat source via evaporation of a working fluid
Implementation Method 2
The vapor flow finally condenses over cooler surfaces, resulting in uniform heat distribution from an evaporation surface (heat source interface) to a condensation surface
Implementation Method 3
Vapor chambers are formed by flattening heat pipes to around 30% to 60% of their original diameter
Implementation Method 4
a copper plate interposed between the vapor chamber and heatsink to enhance stability and heat conduction
Data Source
AI summary
A heat dissipation device includes a vapor chamber, a heatsink, and a heat dissipation plate. The vapor chamber includes a first plate, a second plate that is connected to the first plate to form a chamber between the first and second plates, and a plurality of first support structures disposed within the chamber, opposite ends of each of the first support structures are connected to the first plate and the second plate respectively, the first support structures are disposed with at least two rows and at least two columns, wherein any two adjacent rows of the first support structures are staggered. The heat dissipation plate is disposed in between the heatsink and the vapor chamber so that the heatsink and the vapor chamber are connected to each other via the heat dissipation plate.