Multi-Layer Vapor Chamber Flow Paths for Thin Device Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing vapor chambers face challenges in improving heat transport capability, particularly in thinner designs required for modern portable electronic devices.
Innovation Solution
A vapor chamber design comprising superposed sheets with specific flow paths and structures to enhance heat transport, including a first flow path and adjacent fluid flow paths, heat insulating parts, and guiding parts, with reinforcing sheets for improved strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat pipe designs are used for cooling, then heat transport capability is achieved, but the device thickness increases which is unsuitable for slim portable terminals
Solution Approach 1:
The vapor chamber is constructed by superposing three sheets (first sheet, second sheet, and third sheet) to form a multi-layered structure. This segmentation allows the creation of distinct flow paths (vapor flow paths and condensate flow paths) within separate layers, enabling efficient heat transport while maintaining a thin overall profile suitable for portable terminals
Solution Approach 2:
The invention transitions from conventional three-dimensional heat pipe structures to a planar, two-dimensional vapor chamber design. The vapor and condensate flow paths are arranged in different planes (first sheet and second sheet respectively), allowing heat transport to occur across the surface area rather than requiring vertical thickness, thus achieving thin-profile cooling
2Temperature
If multiple flow paths are added to improve heat transport, then heat dissipation efficiency increases, but device complexity increases
Solution Approach 1:
Multiple flow paths (vapor flow paths and condensate flow paths) are merged into a unified vapor chamber structure formed by superposed sheets. The flow paths are integrated within the same enclosure, sharing common boundaries and interfaces, which simplifies manufacturing while maintaining efficient heat transport through coordinated vapor and condensate circulation
Solution Approach 2:
The third sheet serves multiple functions: it forms the boundary between vapor and condensate flow paths, provides structural support for the vapor chamber, and facilitates the connection between different flow path regions. This multi-functionality reduces the number of separate components needed, thereby reducing overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat transport capability and structural integrity, allowing for efficient heat dissipation in thinner devices.
Implementation Method 1
the working fluid receives heat of the heat source and evaporates near the heat source, and then becomes gas (vapor) and moves in the flow path for vapor
Implementation Method 2
the working fluid changes its phase, to transport heat
Implementation Method 3
is cooled by surroundings that absorb heat of the working fluid and condenses, and changes its phase into the liquifying state
Data Source
AI summary
A vapor chamber having an enclosure which a working fluid is sealed in, the enclosure including: a first flow path; and a fluid flow path part that is adjacent to the first flow path.