Vapor Chamber Flow-Path Segmentation for Slim Device Heat Transport
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Solution Overview
Problem
Existing vapor chambers face challenges in achieving high heat transport capability due to limitations in design and structure, which hinder efficient heat dissipation in slimmed-down electronic devices.
Innovation Solution
The vapor chamber is designed with varying projecting amounts and communicating opening pitches in vapor and condensate flow paths, along with specific wall part widths and groove configurations, to enhance heat transport efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional heat pipe designs are used, then cooling function is provided, but heat transport capability is insufficient for slimmed-down electronic devices
Solution Approach 1:
The vapor chamber is segmented into multiple vapor flow paths and multiple condensate flow paths that are arranged alternately. This segmentation increases the total heat transport capacity by providing multiple parallel channels for heat transfer, while each individual path maintains a simple structure suitable for slimmed-down devices.
Solution Approach 2:
The vapor flow paths and condensate flow paths are arranged in alternating patterns with different local configurations. The vapor flow paths have wider widths in heat source contact regions to enhance heat absorption, while condensate flow paths are positioned to optimize reflux efficiency. This local quality variation maximizes heat transport capability without requiring complex overall restructuring.
2Power
If vapor flow paths and condensate flow paths are disposed between flat plates, then heat transport function is achieved, but heat transport capability is limited
Solution Approach 1:
The single vapor flow path is divided into multiple segmented vapor flow paths, and the condensate flow path is divided into multiple segmented condensate flow paths. These segmented paths are distributed between the flat plates to increase the effective heat transport area and improve overall heat dissipation efficiency.
Solution Approach 2:
The flow paths are arranged in an alternating pattern across the thickness dimension of the vapor chamber. By utilizing the thickness dimension effectively with alternating vapor and condensate paths, the heat transport capability is enhanced without significantly increasing the overall device thickness, maintaining ease of operation in slimmed-down devices.
3Power
If uniform flow path design is used, then manufacturing is simplified, but heat transport efficiency is reduced
Solution Approach 1:
Different regions of the vapor chamber have locally optimized flow path configurations. The vapor flow paths have varying widths depending on the heat source distribution, with wider paths in high-heat regions and narrower paths in low-heat regions. This local quality approach maximizes heat transport efficiency while keeping the overall configuration relatively simple.
Solution Approach 2:
The vapor flow paths and condensate flow paths are designed with asymmetric configurations to match the actual heat source distribution patterns. Rather than uniform symmetric paths, the asymmetric design allows better heat transport efficiency by directing more flow capacity toward regions with higher heat generation, while maintaining manageable structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved design enhances heat transport capability by optimizing fluid flow and reducing stress concentrations, leading to more effective heat dissipation in electronic devices.
Implementation Method 1
a working fluid receives heat from the heat source to evaporate near the heat source. The working fluid then becomes a gas (vapor)
Implementation Method 2
The working fluid then becomes a gas (vapor), and moves in the vapor flow path. This allows the heat of the heat source to be smoothly transported to a place apart from the heat source
Implementation Method 3
heat thereof is absorbed by surroundings, and then the working fluid is cooled to condense, and changes the phase thereof into the liquid state
Implementation Method 4
The working fluid, which has changed the phase thereof into the liquid state, passes through the condensate flow path, returns to the position around the heat source
Data Source
AI summary
A vapor chamber in which an enclosed space is formed, and a working fluid is sealed in this space, the enclosed space including: a plurality of condensate flow paths through which a fluid that is the working fluid in a condensing state flows; and vapor flow paths through which a vapor that is the working fluid in a vaporizing state flows, wherein each of projecting parts with which each of the vapor flow paths is provided has a projecting amount varying in an extending direction of the vapor flow paths; a pitch for opening parts that allow the vapor flow paths and the condensate flow paths to communicate varies in the extending direction of the vapor flow paths; or wall parts that separate the flow paths each have a given relationship with a transverse cross section of a given flow path.