Vapor Chamber Cavity Layout for Faster Gas Diffusion Cooling
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Solution Overview
Problem
Existing vapor chambers in electronic devices have low heat dissipation efficiency and limited capability, restricting performance improvement.
Innovation Solution
The vapor chamber design includes varying sizes of cavities and capillary structures to facilitate efficient gas diffusion and liquid backflow, with increased capillary force in specific areas to address anti-gravity issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the size of the second cavity is increased to reduce air resistance and improve gas through-flow capability, then heat dissipation efficiency is improved, but the device complexity increases due to varying cavity sizes
Solution Approach 1:
The vapor chamber employs different cavity sizes in different regions: the first cavity (heat absorption area) has a first size, while the second cavity (heat dissipation area) has a second size that is larger than the first size. This local differentiation optimizes gas flow characteristics in each region, reducing air resistance in the heat dissipation area while maintaining effective heat absorption in the heat generation area, thereby improving overall heat dissipation efficiency without requiring complete redesign of the entire structure.
2Productivity
If the capillary structure size in the second area is increased to increase capillary force and liquid backflow capability, then heat dissipation capability is improved, but the device complexity increases
Solution Approach 1:
The capillary structure is designed with varying dimensions across different areas: in the first area (heat absorption), the capillary structure has a first size, while in the second area (heat dissipation), the capillary structure has a second size that is larger than the first size. This local variation increases the capillary force in the heat dissipation area, enhancing liquid backflow capability and ensuring reliable liquid return even under anti-gravity conditions, while avoiding unnecessary complexity in the heat absorption area where smaller capillary dimensions are sufficient.
Solution Approach 2:
The capillary structure dimensions are dynamically adapted to the local requirements: smaller capillary structures are used in the heat absorption area where liquid generation occurs, and larger capillary structures are used in the heat dissipation area where liquid backflow is critical. This dynamic sizing allows the system to optimize liquid circulation performance across different operational zones without requiring a uniformly complex structure throughout.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency by ensuring timely and rapid gas diffusion and liquid circulation, even in anti-gravity scenarios, thereby improving overall heat dissipation capability.
Implementation Method 1
The liquid liquefied in the second area flows back to the first area under a capillary force of the capillary structure
Implementation Method 2
Heat energy of the heating element is transferred to the first area, and a liquid working medium in the first area is vaporized into gas
Implementation Method 3
After the gas is in contact with the second area that has a low temperature, the gas is liquefied into liquid. In addition, the heat energy is dissipated
Data Source
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AI summary
This application relates to a vapor chamber and an electronic device. The vapor chamber is used in the electronic device. The vapor chamber includes a first cover plate, a second cover plate, and a capillary structure. An edge of the first cover plate is fastened to an edge of the second cover plate, to form a closed cavity between the first cover plate and the second cover plate. The capillary structure is located in the cavity, and the capillary structure is configured to guide flow of liquid in the cavity. The cavity includes a first cavity and a second cavity that communicate with each other, the first cavity is located in a first area of the vapor chamber, the second cavity is located in a second area of the vapor chamber, and the first area is used to connect to a heating element of the electronic device. A size of the second cavity in a first direction is greater than a size of the first cavity in the first direction, and the first direction is an arrangement direction of the first cover plate and the second cover plate. In embodiments of this application, the size of the second cavity is increased, so that air resistance of gas in the second cavity is small, and a through-flow capability of the gas is increased. This facilitates timely and rapid diffusion of the gas to the second cavity, and improves a heat dissipation capability of the vapor chamber.