Vapor Chamber Insert Body for Chip Thermal Contact
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Solution Overview
Problem
Heatsinks with vapor chambers face challenges in achieving full contact with chips surrounded by proud stiffeners, leading to reduced thermal transfer performance due to the proximity and positioning of the stiffener, which limits the effectiveness of heat dissipation.
Innovation Solution
A vapor chamber design featuring a two-part bottom side with a separately formed insert body that extends through an opening in the bottom body portion, allowing for full contact with the chip and enhanced heat transfer, while maintaining a sealed interior volume for efficient heat dissipation using a fluid vaporization and condensation cycle.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the heatsink is positioned close to the chip surrounded by a proud stiffener, then board real estate is reduced, but full contact between the heatsink and chip is prevented, reducing thermal transfer performance
Solution Approach 1:
The bottom body portion is divided into two separate components: the main bottom body and an insert body. The insert body is a separate component that fits into an opening in the bottom body, creating a segmented structure that can navigate around the stiffener while maintaining contact with the chip.
Solution Approach 2:
The insert body is nested within the bottom body structure, with the insert body fitting into an opening in the bottom body. This nested configuration allows the heatsink to maintain full contact with the chip while the insert body navigates around the proud stiffener.
2Area of stationary object
If the stiffener is positioned proud relative to the chip to reduce board real estate, then space is saved, but the heatsink cannot fully contact the chip, reducing cooling effectiveness
Solution Approach 1:
The bottom body portion is segmented into the main bottom body and a separate insert body. The insert body is specifically designed to contact the chip while the main bottom body is positioned by the stiffener, separating the positioning function from the heat contact function.
Solution Approach 2:
The insert body acts as an intermediary element between the stiffener and the chip. It allows the heatsink to be positioned by the stiffener while maintaining full contact with the chip, mediating the spatial conflict between these two components.
3Ease of manufacture
If a traditional single-piece bottom body is used, then manufacturing is simpler, but full contact with the chip is prevented by the proud stiffener
Solution Approach 1:
The bottom body is divided into two separately manufactured components (bottom body and insert body) that are assembled together. This segmentation allows each component to be manufactured independently with standard processes while achieving the complex final geometry needed for precise chip contact.
Solution Approach 2:
The insert body is pre-formed as a separate component with the precise geometry needed to contact the chip. This preliminary formation of the insert body allows for high precision manufacturing of the contact surface before final assembly with the bottom body.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables improved thermal contact and heat transfer performance by ensuring the vapor chamber's insert body fully contacts the chip without interfering with the stiffener, enhancing the overall cooling efficiency of electrical components.
Implementation Method 1
efficient heat dissipation using a fluid vaporization and condensation cycle
Implementation Method 2
The cooling fins provide a large surface area for the transfer of the heat from the cooling fins to the surrounding environment through convection, conduction, and radiation
Implementation Method 3
The cooling fins provide a large surface area for the transfer of the heat from the cooling fins to the surrounding environment through convection, conduction, and radiation
Implementation Method 4
The cooling fins provide a large surface area for the transfer of the heat from the cooling fins to the surrounding environment through convection, conduction, and radiation
Data Source
AI summary
The present technology relates to heat dissipation systems which may include vapor chambers. Vapor chambers may include top body portions and bottom body portions. A bottom body portion may include a first bottom side and a first perimeter wall extending from a perimeter of the first bottom side. The top body portion may be coupled to the first perimeter wall, and the bottom body portion may define an opening extending between a first inner surface and a first outer surface of the bottom side. Vapor chambers may also include an insert body formed separately from the bottom body portion. The insert body extends through the opening and is coupled to the bottom body portion. A sealed interior volume of the vapor chamber may comprise a first portion defined by the top body portion and the first bottom side; and a second portion defined by the opening and the insert body.