Vapor Chamber with Integrated Rotating Impeller for Thin System Cooling
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Solution Overview
Problem
Current cooling solutions for thin information handling systems, such as notebook computers, face challenges in achieving sufficient airflow and cooling efficiency without increasing system thickness, leading to thermal resistance and reduced performance.
Innovation Solution
The implementation of a vapor chamber apparatus with a cowl-less rotating radial impeller mounted on a three-dimensional vapor chamber, coupled with heat pipe extensions and fin stacks, enhances airflow and cooling surface area, minimizing frictional losses and air pressure drop.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional cowled fan with heat pipe fin stack is used for cooling, then the system can provide cooling function, but the system thickness increases and airflow efficiency is reduced
Solution Approach 1:
The patent removes the cowl (housing) from the fan assembly, exposing the impeller blades directly to the airflow path. This extraction of the cowl component eliminates the thickness constraint while maintaining cooling function, allowing the fan to be integrated flush with the vapor chamber surface.
Solution Approach 2:
The patent integrates the fan assembly directly with the vapor chamber by mounting the impeller hub to the vapor chamber surface, eliminating the need for separate mounting structures and reducing overall system thickness. The fan and heat dissipation components are merged into a unified assembly.
2Productivity
If a conventional cowled fan is used, then the structure is enclosed and protected, but frictional losses increase and net airflow is reduced
Solution Approach 1:
By removing the cowl entirely, the patent eliminates the frictional interface between the cowl walls and airflow. The exposed impeller blades directly move air without the energy losses associated with air turning and friction against cowl surfaces, significantly reducing frictional losses and increasing net airflow.
3Area of stationary object
If a conventional fan with limited surface area is used, then the device complexity is low, but the cooling surface area is insufficient
Solution Approach 1:
The patent extends the heat pipe fins vertically upward from the vapor chamber surface, creating a three-dimensional fin structure that protrudes into the airflow path. This dimensional extension dramatically increases the cooling surface area without requiring a larger footprint, allowing more heat dissipation area within the same spatial envelope.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases net airflow by 20% or more, doubles the fin stack surface area, and reduces thermal resistance by 50% or more compared to conventional fan and fin stack arrangements, resulting in improved cooling power and reduced system thickness.
Implementation Method 1
absorbing heat in the vapor chamber from the one or more heat sources to vaporize at least a portion of liquid working fluid contained within the vapor chamber and cause the vaporized fluid to travel from the vapor chamber to the heat pipe
Implementation Method 2
at least one heat pipe coupled in fluid communication with the vapor chamber, the vapor chamber being an evaporator and the heat pipe being a condenser for a working fluid contained therein
Implementation Method 3
a radial impeller disposed in the cavity and rotatably coupled to the vapor chamber, the radial impeller rotating to draw in air from outside the chassis by a first air flow path through the first air intake opening and to exhaust the air by a second air flow path through the at least one air outlet opening
Data Source
AI summary
Vapor chamber and impeller apparatus and systems for cooling information handling systems and which may be implemented to enable increase in system level airflow and to achieve increased cooling surface for cooling heat generating or heat source components of such systems. In one example, an integrated rotating radial impeller may be mounted to and supported by the vapor chamber, and the vapor chamber apparatus may be coupled to one or more heat pipe extensions and corresponding fin stacks.