Three-Dimensional Vapor Chamber With Interconnected Heat Paths
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Solution Overview
Problem
Current vapor chambers face a challenge in achieving better thermal conductivity while maintaining a compact size, leading to installation and space constraints.
Innovation Solution
A three-dimensional thermal-conductive vapor chamber design with intersecting thermal-conductive and fin plates connected by copper powder pillars and capillary structures, forming an extended heat transfer path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heat dissipation area is increased to improve thermal conductivity, then the thermal conductivity is improved, but the floor space requirement increases
Solution Approach 1:
The patent transitions from a two-dimensional heat dissipation approach to a three-dimensional structure by adding fin plates that extend perpendicular to the thermal-conductive plate. This vertical expansion creates multiple heat dissipation surfaces (front plate, rear plate, and side fins) that utilize the third dimension, thereby increasing the effective heat dissipation area without proportionally increasing the floor space occupation.
Solution Approach 2:
The fin plates are positioned to extend into the space above and below the thermal-conductive plate, effectively nesting heat dissipation structures within the vertical profile. The front and rear plates with their respective fins create a nested arrangement that maximizes heat dissipation volume within the constraints of the overall chamber dimensions.
2Productivity
If the overall area is expanded to increase heat dissipation capacity, then the heat dissipation capability is improved, but the installation and placement convenience deteriorates
Solution Approach 1:
By utilizing the vertical dimension for heat dissipation through fin plates, the design achieves high heat dissipation capability without proportionally increasing the horizontal footprint. This maintains a compact floor space configuration that is easier to install and place in various locations while still providing enhanced heat dissipation through the three-dimensional fin structure.
3Temperature
If the heat transfer path is extended to improve heat dissipation effect, then the heat dissipation effect is improved, but the device complexity increases
Solution Approach 1:
The heat transfer path is segmented into multiple sections through the thermal-conductive plate and fin plate assemblies. The thermal connection structure divides the heat transfer pathway into distinct segments (through the plate, through the fin plates, and through the copper powder pillars), creating a longer overall path while maintaining modular construction that simplifies manufacturing and assembly.
Solution Approach 2:
The thermal connection structure acts as an intermediary element between the thermal-conductive plate and fin plates, using copper powder pillars to facilitate heat transfer. This intermediary structure extends the heat transfer path while providing a standardized connection mechanism that reduces overall device complexity through repeated use of the same connection principle.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat conduction and dissipation capabilities within a limited area, improving performance by allowing heat to be dissipated through a longer path without increasing overall size.
Implementation Method 1
the thermal conductivity of current vapor chambers mostly depends on its area and the amount of thermal-conductive structures such as interior capillary structures
Implementation Method 2
interior capillary structures
Implementation Method 3
the thermal connection structure includes copper powder pillars disposed inside the thermal-conductive plate
Data Source
AI summary
A three-dimensional thermal-conductive vapor chamber includes: a thermal-conductive plate, a fin plate and a thermal connection structure. The fin plate is connected to the thermal-conductive plate and has thermal conductivity. A cross-section of the thermal-conductive plate and a cross-section of the fin plate are two different planes that intersect with each other. The thermal connection structure is disposed between the thermal-conductive plate and the fin plate, and the fin plate is connected to the thermal-conductive plate through the thermal connection structure. The thermal connection structure connects interiors of the thermal-conductive plate and the fin plate to form an interconnected heat transfer path between the thermal-conductive plate and the fin plate.