Vapor Chamber Lines for Display Heat Dissipation
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Solution Overview
Problem
Existing display devices face challenges in efficiently releasing heat from heating elements, particularly in ultra-thin designs with large screens, which can lead to thermal damage and reduced performance.
Innovation Solution
A vapor chamber with a heat-absorbing part in contact with the heating element and a heat-releasing part positioned above, coupled with a plurality of lines on the outer surface that extend in the direction corresponding to the axis connecting the heat-absorbing and heat-releasing parts, enhancing heat transfer and dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a vapor chamber is used to release heat from a heating element, then heat dissipation capability is improved, but the device volume increases
Solution Approach 1:
The vapor chamber is divided into multiple functional regions: a heat absorption region positioned adjacent to the heating element, a heat transfer region with fluid circulation pathways, and a heat dissipation region at the outer surface. This segmentation allows each region to perform its specific function efficiently while reducing the overall volume required for effective heat management.
Solution Approach 2:
Different regions of the vapor chamber are designed with different properties: the heat absorption region has high thermal conductivity materials in direct contact with the heating element, the fluid channels are strategically positioned to maximize heat transfer efficiency, and the outer surface includes heat dissipation structures. This local optimization allows effective heat dissipation with minimized overall volume.
2Temperature
If the vapor chamber is positioned close to the heating element for efficient heat absorption, then heat transfer efficiency is improved, but thermal damage to adjacent components increases
Solution Approach 1:
A fluid medium is introduced as an intermediary between the heating element and the vapor chamber structure. The fluid circulates through channels in the heat transfer region, absorbing heat from the heating element and transporting it to the heat dissipation region. This intermediary mechanism enables efficient heat transfer while distributing thermal energy away from sensitive adjacent components.
Solution Approach 2:
The heat dissipation function is extracted and positioned in a heat dissipation region that is spatially separated from the heating element and adjacent components. By extracting the heat release function to a distant location and using fluid circulation for heat transport, the design achieves efficient heat transfer without exposing nearby components to damaging temperatures.
3Ease of manufacture
If the vapor chamber structure is simplified for ease of manufacture, then manufacturing cost is reduced, but heat-releasing capability deteriorates
Solution Approach 1:
The vapor chamber is segmented into modular regions (heat absorption region, heat transfer region, heat dissipation region) that can be manufactured separately and then assembled. This modular segmentation simplifies the manufacturing process for each individual component while maintaining the overall heat-releasing capability through the integrated structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the maximum temperature of both the heating element and adjacent components, improving the heat-releasing capability and preventing thermal damage, even under high load conditions.
Implementation Method 1
a heat-absorbing part in contact with the heating element
Implementation Method 2
a heat-releasing part positioned above the heat-absorbing part and spaced apart from the PCB
Implementation Method 3
an internal space for fluid to flow
Implementation Method 4
an internal space for fluid to flow
Implementation Method 5
an internal space for fluid to flow
Data Source
AI summary
A display device is disclosed. The display device includes a display panel, a frame positioned behind the display panel, a PCB coupled to the frame and including a heating element, and a vapor chamber including an internal space for fluid to flow, wherein the vapor chamber includes a heat-absorbing part in contact with the heating element, a heat-releasing part positioned above the heat-absorbing part and spaced apart from the PCB, and a plurality of lines formed at an outer side of the vapor chamber, wherein the plurality of lines extend in a first direction corresponding to an axis that connects a center of the heat-absorbing part to a center of the heat-releasing part.