Braided-Channel Vapor Chamber Heatsink for Multi-Source Cooling
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Solution Overview
Problem
Existing vapor chamber heatsink assemblies face challenges in effectively dissipating heat from multiple heat sources with different power requirements and temperatures, leading to issues like dry-out and overheating due to fluid agglomeration, which can damage electronic elements.
Innovation Solution
A vapor chamber heatsink assembly with a plurality of heatsink fins featuring airflow through holes and braided channels that create turbulent airflow, along with vapor braided channels to manage fluid flow, preventing agglomeration and enhancing heat dissipation across multiple heat sources.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the amount of heatsink fins is increased for a given attachment area, then the surface area is increased, but the average amount of heat transferred from each square centimeter of the surface area decreases due to restricted airflow
Solution Approach 1:
The heatsink fins incorporate porous materials or structures that allow airflow to penetrate through the fin array rather than being blocked by it. This enables increased surface area while maintaining airflow permeability, resolving the contradiction between maximizing surface area and preserving heat transfer efficiency per unit area.
2Area of stationary object
If the height of the fins is increased for a given attachment area, then the surface area is increased, but the fin efficiency decreases and mass, weight and costs increase
Solution Approach 1:
The invention transitions from traditional vertical fin structures to a configuration where airflow moves through the fins in multiple dimensions, including horizontal penetration. This dimensional change allows for optimized surface area without requiring excessive fin height, thereby maintaining fin efficiency while reducing mass and weight.
3Adaptability or versatility
If the dimensions of the vapor chamber are increased to accommodate more heat flux source interfaces, then the heat spreading capability is improved, but the weight on the surface of the vapor chamber increases
Solution Approach 1:
The vapor chamber is divided into multiple segmented regions, each capable of independently managing heat from different heat flux sources. This segmentation allows the system to handle multiple heat sources without requiring a single large vapor chamber, thereby reducing the overall weight on the vapor chamber surface while maintaining adaptability.
4Adaptability or versatility
If multiple heat flux sources are present with different temperatures, then the heat dissipation coverage is improved, but dry-out and overheating occur due to working fluid agglomeration near higher temperature sources
Solution Approach 1:
Different regions of the vapor chamber are designed with locally optimized properties tailored to the specific thermal requirements of each heat flux source. This includes varying wick structures, working fluid distributions, and thermal conductivity characteristics in different zones, enabling each region to effectively manage its local heat load without causing dry-out or overheating, thus maintaining reliable thermal performance across all heat sources.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The assembly effectively manages heat dissipation by creating turbulent airflow and preventing fluid agglomeration, ensuring efficient thermal performance and reducing the risk of overheating in electronic components.
Implementation Method 1
The plurality of airflow through holes force airflow to flow from a second direction perpendicular to the airflow flowing across the surfaces between each neighboring heat exchanger fin from a first direction, agitating airflow, creating turbulent airflow, thus, eliminating dead air between each heat exchanger fin
Implementation Method 2
Vapor chambers are vacuum containers that carry heat by evaporation of a working fluid, which is spread by a vapor flow filling the vacuum
Implementation Method 3
Vapor chambers are vacuum containers that carry heat by evaporation of a working fluid
Implementation Method 4
The vapor flow eventually condenses over cooler surfaces, and, as a result, the heat is distributed from an evaporation surface (heat flux source interface) to a condensation surface (cooling surface)
Implementation Method 5
The plurality of heatsink fins increases the rate of convective heat transfer to or from an environment of the vapor chamber heatsink assembly, by increasing the surface area of the heat flux source interface
Implementation Method 6
Heat is transferred from the heat source to the vapor chamber, the vapor chamber to the plurality of heatsink fins and the environment
Data Source
AI summary
A vapor chamber heatsink assembly, under vacuum, having a working fluid therein, comprising a plurality of heatsink fins and a vapor chamber is provided. The vapor chamber and the plurality of heatsink fins each comprise a plurality of obstructers defining a plurality of braided channels therein. Thus, the condenser regions of the vapor chamber are expanded to the plurality of heatsink fins. When heat from a greater temperature heat source and a lower temperature heat source is applied to the vapor chamber, via the plurality of obstructers and braided channels, the working fluid and liquid vapor travel therethrough, providing an effective phase change mechanism to the greater temperature heat source, while concurrently, hindering agglomeration of working fluid thereto. An effective phase change mechanism is also concurrently provided to the lower temperature heat source due to the non-agglomeration of working fluid to the greater temperature heat source.