Vapor Chamber Pedestal for Substrate Processing Temperature Uniformity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Substrate processing systems face challenges in achieving uniform pedestal temperature due to localized temperature differences despite the use of multiple heaters, leading to increased cost and complexity without ensuring desired temperature uniformity.
Innovation Solution
A vapor chamber with capillary structures is integrated between the pedestal and baseplate, utilizing a working fluid that vaporizes and condenses on cooler surfaces to achieve uniform temperature through capillary action, reducing the need for multiple heating zones.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple heaters are used in different heating zones to improve temperature uniformity, then temperature uniformity is improved, but device complexity and cost increase
Solution Approach 1:
The patent combines multiple heating zones and heaters into a single vapor chamber structure that provides uniform heating across the entire substrate surface. The vapor chamber integrates the function of multiple heaters into one component, eliminating the need for separate heating zones while maintaining temperature uniformity.
Solution Approach 2:
The vapor chamber acts as an intermediary between the heat source and the substrate, distributing heat uniformly across its surface. This intermediary structure eliminates the need for multiple direct heating elements by providing a single interface that ensures even heat distribution to the substrate.
2Temperature
If as many as 30 heaters are added to achieve high temperature uniformity, then temperature uniformity is improved, but cost and complexity increase significantly
Solution Approach 1:
The invention merges the function of 30 separate heaters into a single vapor chamber component. This consolidation dramatically simplifies manufacturing by reducing the number of parts from 30 to 1, while maintaining the ability to achieve high temperature uniformity across the substrate surface.
3Temperature
If multiple heaters and control systems are used to control temperature, then temperature control capability is improved, but points of failure increase
Solution Approach 1:
The vapor chamber consolidates multiple heating elements and their associated control systems into a single integrated component. This reduction in the number of independent components directly reduces the number of potential failure points, thereby improving system reliability while maintaining effective temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides high thermal conductivity, achieving temperature uniformity on the pedestal surface with reduced complexity and cost, as the vapor chamber passively seeks thermal uniformity by conducting heat at a high rate, thereby enhancing processing consistency.
Implementation Method 1
a working fluid that vaporizes and condenses on cooler surfaces to achieve uniform temperature through capillary action
Implementation Method 2
utilizing a working fluid that vaporizes and condenses on cooler surfaces to achieve uniform temperature through capillary action
Implementation Method 3
the vapor chamber passively seeks thermal uniformity by conducting heat at a high rate
Data Source
AI summary
A substrate support for a substrate processing system includes a pedestal including an upper surface and a lower surface. A vapor chamber is arranged between the pedestal and a baseplate, defines a vapor chamber cavity and includes a plurality of capillary structures arranged on a surface inside of the vapor chamber cavity.