Vapor Chamber Pillar Layout for Pressure Resistance and Cooling
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Solution Overview
Problem
Existing vapor chambers face challenges in maintaining pressure resistance and cooling performance due to the expansion force exceeding the bonding limit of pillar sections at high temperatures, leading to potential deformation and reduced efficiency.
Innovation Solution
A vapor chamber design with a first and second substrate, an accommodation chamber, and a working medium, featuring a higher density of inner pillars in the region corresponding to the heat-generating body, along with outer pillars in the remaining area, to enhance pressure resistance and maintain cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the number of pillar sections is increased to increase pressure resistance, then the pressure resistance is improved, but the internal space is narrowed and working medium flow is reduced, causing a decrease in cooling performance
Solution Approach 1:
The patent applies local quality by differentiating the pillar arrangement into two regions: a first region with a higher density of pillar sections to provide enhanced pressure resistance where needed, and a second region with fewer or no pillar sections to maintain adequate internal space for working medium flow and cooling performance. This localized differentiation resolves the contradiction by optimizing pillar distribution rather than uniformly increasing them throughout the entire vapor chamber.
2Use of energy by moving object
If the heat source is bonded to the vapor chamber to improve heat transfer efficiency, then the heat transfer efficiency is improved, but the internal pressure increases and expansion force acts on the vapor chamber
Solution Approach 1:
The patent addresses this contradiction by implementing localized pillar sections primarily in the first region where heat transfer occurs. These localized pillars provide structural reinforcement to withstand the expansion forces generated during high-temperature heat transfer operations, while maintaining adequate internal space in other regions to accommodate pressure changes without compromising overall cooling performance.
3Stability of the object's composition
If pillar sections are provided to suppress deformation, then the structural stability is improved, but the bonding limit is exceeded at high temperatures, causing the vapor chamber to expand
Solution Approach 1:
The patent resolves this contradiction by concentrating pillar sections in the first region where they are most needed for structural stability during heat transfer, while reducing or eliminating them in the second region to minimize interference with working medium flow. This localized approach ensures that the bonding limit is not exceeded even at high temperatures, as the pillars are strategically positioned only where structural reinforcement is critical.
Solution Approach 2:
The patent applies partial action by providing pillar sections only in the first region rather than uniformly throughout the entire vapor chamber. This partial implementation is sufficient to provide the necessary structural stability and withstand expansion forces during heat transfer, while avoiding excessive pillars that would narrow the internal space and hinder working medium flow in the second region.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively suppresses vapor chamber expansion while ensuring efficient diffusion of the working medium, stabilizing the cooling performance and operation of electronic devices.
Implementation Method 1
a working medium that is accommodated in the accommodation chamber and that transitions between a gas phase and a liquid phase by heat
Implementation Method 2
a plurality of pillars between inner surfaces of the first and second substrates within the accommodation chamber
Implementation Method 3
a first substrate that has thermal conductivity
Data Source
AI summary
The vapor chamber includes a first substrate that has thermal conductivity; a second substrate opposed to the first substrate and having thermal conductivity; an accommodation chamber having an accommodation space formed by bonding a peripheral section of the first substrate and a peripheral section of the second substrate; the working medium accommodated in the accommodation chamber and transitioning between gas and liquid phases due to heat; anda plurality of pillars arranged between an inner surface of the first substrate and an inner surface of the second substrate in the accommodation chamber, wherein the first substrate has a placement region located on an outer surface of the first substrate and in which a heat-generating body is arranged, a corresponding region located on the inner surface of the first substrate and corresponding to the placement region, the plurality of pillars has at least one inner pillar arranged in the corresponding region, a plurality of outer pillars arranged outside the corresponding region, and the number of inner pillars per unit area in the corresponding region is larger than the number of pillars per unit area in the entire accommodation chamber.