Vapor Chamber Cooling Module With Communicating Pipe Heat Spreading
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Solution Overview
Problem
Existing heat dissipation modules in notebook computers suffer from poor heat conduction efficiency due to poor welding quality between the vapor chamber and heat pipe, leading to heat concentration at the proximal end of the condensing section and inefficient use of the heat pipe.
Innovation Solution
A heat dissipation module featuring a vapor chamber with a first and second cavity, and a communicating pipe with a smooth inner surface and wick structure, facilitating a one-way gas-liquid two-phase change process to distribute heat evenly and enhance heat dissipation performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a traditional heat pipe is used with welding connection to vapor chamber, then the structure is simple, but the heat conduction efficiency deteriorates due to poor welding quality
Solution Approach 1:
The communicating pipe is integrated with the vapor chamber through direct communication design, eliminating the need for separate welding connections between heat pipe and vapor chamber. The first cavity and second cavity are directly connected through the communicating pipe, ensuring reliable heat conduction without welding quality issues.
Solution Approach 2:
The communicating pipe acts as an intermediary component that facilitates heat and mass transfer between the first cavity and second cavity. It includes a smooth inner surface to reduce flow resistance and enable efficient two-phase flow of working fluid.
2Ease of manufacture
If heat pipe condensing section is designed with traditional structure, then manufacturing is easy, but heat dissipation performance deteriorates due to heat concentration at proximal end
Solution Approach 1:
The vapor chamber is divided into a first cavity and a second cavity that are communicated with each other. The communicating pipe connects these two cavities, segmenting the heat dissipation path to prevent heat concentration at a single location and improve overall heat dissipation performance.
Solution Approach 2:
The inner wall surface of the communicating pipe is designed with different qualities: a smooth inner surface in the first pipe to reduce flow resistance, and a wick structure in the second pipe to facilitate capillary action and working fluid return, optimizing local heat transfer characteristics.
3Ease of manufacture
If vapor chamber and heat pipe are not communicated, then assembly is simple, but heat dissipation efficiency deteriorates due to poor heat conduction between components
Solution Approach 1:
The communicating pipe is integrated into the vapor chamber structure, creating a direct communication path between the first cavity and second cavity. This merging design ensures efficient heat conduction and working fluid circulation without requiring complex assembly procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module accelerates the gas-liquid two-phase change process, improving heat dissipation efficiency by diffusing heat outward and discharging it through the communicating pipe, thereby preventing heat concentration and enhancing overall heat dissipation performance.
Implementation Method 1
When the evaporating area absorbs heat from the heat source, the liquid working fluid in the cavity of the vapor chamber evaporates into a gaseous working fluid
Implementation Method 2
The gaseous working fluid is exothermically condensed into the liquid working fluid in the relatively low temperature area
Implementation Method 3
flows back to the evaporating area by capillary force
Implementation Method 4
an inner wall surface of the second pipe is provided with a wick structure
Data Source
AI summary
A heat dissipation module adapted for an electronic device with a fan is provided. The heat dissipation module includes a vapor chamber and a communicating pipe. The vapor chamber has a first cavity having an evaporating area and a second cavity communicated with the first cavity. The communicating pipe includes a first pipe and a second pipe communicated with the first pipe, wherein the first pipe is communicated with the first cavity, and the second pipe is communicated with the second cavity. An inner wall surface of the first pipe is a smooth surface, and an inner wall surface of the second pipe is provided with a wick structure. The first cavity, the second cavity and the communicating pipe surround and form a hollow area, wherein the fan is adapted for being disposed in the hollow area, and an air outlet of the fan faces the second pipe.