Vapor Chamber Power Module Cooling for Semiconductor Chips
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Solution Overview
Problem
Conventional heat dissipation methods for power modules in electrified vehicles are limited in their ability to efficiently eliminate heat generated by semiconductor chips, which is necessary for stable operation.
Innovation Solution
A power module design incorporating vapor chambers with a fluid flow, where the vapor chambers have a shape that expands the heat transfer range, connecting semiconductor chips and substrates, and includes a double-sided cooling method with substrates on both sides of the chips, enhancing thermal conductivity and cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling channels are used to dissipate heat from semiconductor chips, then the power module can operate with basic cooling, but the heat dissipation efficiency is limited and thermal conductivity is insufficient
Solution Approach 1:
The patent employs vapor chambers that utilize phase transition of working fluid (evaporation and condensation) to transfer heat from the semiconductor chip to the substrate. The vapor chamber converts thermal energy into phase change cycles, achieving high-efficiency heat dissipation without requiring complex external cooling systems.
Solution Approach 2:
The vapor chamber acts as an intermediary heat transfer device between the semiconductor chip and the substrate. It mediates the heat transfer process by containing working fluid that undergoes phase change, effectively bridging the thermal gap and improving overall heat dissipation efficiency.
2Temperature
If the vapor chamber plane area is increased to expand heat transfer range, then thermal conductivity improves, but the device occupies more space
Solution Approach 1:
The vapor chamber is strategically positioned and sized to cover only the necessary heat-generating regions of the semiconductor chip. The plane area of the vapor chamber is optimized to match the active heat transfer zones, providing localized high-efficiency cooling without unnecessarily increasing overall device area.
Solution Approach 2:
The patent utilizes the vertical dimension by placing the vapor chamber between the semiconductor chip and substrate, allowing heat transfer in the thickness direction. This dimensional approach enables effective heat dissipation without proportionally increasing the planar area of the device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The expanded heat transfer range improves thermal conductivity and cooling efficiency, allowing the power module to operate stably at lower temperatures.
Implementation Method 1
at least one vapor chamber having a fluid flowing therein and disposed between the semiconductor chip and one of the at least one substrate
Implementation Method 2
each of the at least one vapor chamber includes: a first side thereof including a plane area greater than or equal to a plane area of the semiconductor chip and connected to the metal circuit of the one of the at least one substrate
Data Source
AI summary
A power module include at least one substrate including an insulating layer and a metal circuit disposed on a first side of the insulating layer, a semiconductor chip, and at least one vapor chamber including a fluid flowing therein and disposed between the semiconductor chip and one of the at least one substrate, wherein each of the at least one vapor chamber includes a first side thereof including a plane area greater than or equal to a plane area of the semiconductor chip and connected to the metal circuit of the one of the at least one substrate, and a second side thereof facing the first side along a first direction and connected to the semiconductor chip.