Vapor Chamber Vent-Hole Layout for Easier Sealing

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Solution Overview

Problem

Conventional vapor chambers require cumbersome processes like radio frequency heating and soldering for sealing after the filling/degassing process, which can adversely affect the capillary structure and limit the pipe diameter of the degassing pipe due to the location of the pipe insertion portion at the lateral edge.

Innovation Solution

The vapor chamber design modifies the installation position of the vent hole for the degassing pipe to the second cover, allowing for a convenient sealing method without radio frequency heating and soldering, and enabling a larger pipe diameter for the degassing pipe.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the pipe insertion portion is located at the lateral edge of the vapor chamber, then the sealing process can be performed, but the pipe diameter is limited by the thickness of the vapor chamber and multiple cumbersome sealing processes are required

Engineering Contradiction:
Improvesealing process convenienceVSAvoidsealing process complexity
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The invention moves the pipe insertion portion from the lateral edge (one-dimensional constraint) to the top surface (two-dimensional freedom), allowing the pipe to pass through the thickness direction of the vapor chamber. This dimensional change eliminates the constraint that pipe diameter must be smaller than chamber thickness and enables direct sealing from above without complex lateral sealing processes.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If radio frequency heating and soldering processes are used for sealing the pipe insertion portion, then the gap between the pipe and vapor chamber can be sealed, but the capillary structure may be damaged and solder may flow into the vapor chamber

Engineering Contradiction:
Improvesealing reliabilityVSAvoiddamage to capillary structure
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The invention extracts the harmful sealing processes (radio frequency heating and soldering) from the system by providing pre-formed sealing structures (sealing rings and sealing plugs) that eliminate the need for thermal sealing processes. This removes the source of harm to the capillary structure while maintaining sealing functionality.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The sealing rings and sealing plugs are pre-installed on the vapor chamber and pipe respectively before assembly. This preliminary action ensures that the sealing function is already in place before the components are assembled, eliminating the need for subsequent heating and soldering processes that could damage the capillary structure.

Inventive Principle:
Principle #10Preliminary action

3Ease of manufacture

If the pipe insertion portion is formed by stamping process at the lateral edge, then the vapor chamber can be manufactured, but part of the vapor chamber is sacrificed and the appearance is adversely affected

Engineering Contradiction:
Improvevapor chamber manufacturingVSAvoidvapor chamber appearance
Core Design Contradiction:
Ease of manufactureVSShape

Solution Approach 1:

The invention relocates the pipe insertion from the lateral edge to the top surface of the vapor chamber. This allows the pipe to pass through the thickness direction without requiring stamping or cutting operations on the lateral edges, preserving the complete surface area of the vapor chamber and eliminating appearance defects while maintaining manufacturability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces the rat tail area of the vapor chamber, increasing the heat dissipation area, and prevents the capillary structure from being adversely affected by the sealing processes, while also allowing for a larger pipe diameter for the degassing pipe.

Implementation Method 1

The working fluid in the evaporation space is evaporated into vapor

Methodology Applied
Scientific EffectEvaporation: Evaporation

Implementation Method 2

The working fluid flowing to the condensation space is condensed into liquid

Methodology Applied
Scientific EffectCondensation: Condensation

Implementation Method 3

flows back to the evaporation space with the help of the capillary structure

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 4

flows to the condensation space due to the pressure difference

Methodology Applied
Scientific EffectPressure gradient: Pressure Gradient

Data Source

PatentUS12345473B2Vapor chamber
Publication Date: 2025.07.01 COOLER MASTER CO LTD
  • US12345473B2 patent drawing
  • US12345473B2 patent drawing
  • US12345473B2 patent drawing

AI summary

A vapor chamber includes a first cover, a second cover, a sealing ring and a sealing plug. The first cover has a thermal contact surface. The second cover is coupled with the first cover so as to form an interior space together, and the second cover has a vent hole. The sealing ring has a channel and at least one opening. The opening is in fluid communication with the channel, the sealing ring is clamped between the first cover and the second cover, and the vent hole is in fluid communication with the interior space via the channel and the opening. The vent hole and the channel are plugged with the sealing plug so as to seal the interior space.