Vapor Chamber Segmented Cavity for Uniform Heat Distribution
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Solution Overview
Problem
Vapor chambers used in electronic devices often fail to efficiently distribute heat due to uneven heat distribution, leading to potential overheating of electronic components.
Innovation Solution
A vapor chamber design featuring a specific interior cavity structure with support and heat transfer structures that allow for even heat distribution and efficient fluid flow, where the working fluid transitions between phases to effectively dissipate heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional vapor chamber design is used, then the structure is simple, but heat distribution is uneven and inefficient
Solution Approach 1:
The interior cavity is segmented into multiple portions (first portion, second portions, third portions) with different volumes and configurations. This segmentation allows optimized placement of heat transfer structures in high-heat areas while maintaining simpler structures in lower-heat areas, improving overall heat distribution efficiency without requiring complete redesign of the entire chamber.
Solution Approach 2:
Different portions of the interior cavity are designed with different structural qualities - the first portion has greater volume and contains multiple heat transfer structures, while the second and third portions have smaller volumes and different configurations. This local differentiation optimizes heat transfer in high-heat regions while reducing complexity in areas requiring less thermal management.
2Reliability
If heat transfer structures are added to improve heat distribution, then heat dissipation efficiency increases, but device complexity increases
Solution Approach 1:
Heat transfer structures are segmented and placed only in specific portions (first, second, and third portions) rather than uniformly throughout the entire cavity. This targeted placement improves heat distribution where needed while minimizing the total number of structures required, balancing performance with complexity.
Solution Approach 2:
The density and configuration of heat transfer structures vary by location - more structures are placed in the first portion where heat generation is highest, while the second and third portions have fewer or differently configured structures. This local optimization achieves uniform heat distribution without requiring excessive structures throughout the entire chamber.
3Reliability
If the vapor chamber volume is increased to improve heat capacity, then heat dissipation performance improves, but the device size increases
Solution Approach 1:
The vapor chamber volume is segmented into functional portions with different capacities - the first portion has greater volume for high heat capacity requirements, while the second and third portions have smaller volumes. This segmentation allows the chamber to achieve sufficient total heat dissipation capacity while minimizing the overall volume by concentrating capacity where most needed.
Solution Approach 2:
Different portions of the vapor chamber are designed with different volume characteristics - the first portion has larger volume to handle high heat loads, while the second and third portions have smaller volumes appropriate for their lower heat transfer requirements. This local volume optimization achieves adequate heat dissipation capacity without maximizing overall chamber volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat dissipation by increasing temperature differences and fluid flow velocity, ensuring even heat distribution and improved thermal performance, reducing the risk of overheating in electronic devices.
Implementation Method 1
the working fluid transitions between a liquid phase and a gas phase when heated, and the pair of second portions and the pair of third portions are configured to have the gas phase of the working fluid condenses back into a liquid phase when cooled
Implementation Method 2
The generated heat of the electronic component is conducted through a limited area of the electronic component to a larger area of the vapor chamber
Data Source
AI summary
A vapor chamber including a first plate, second plate, plurality of support structures, and plurality of heat transfer structures is provided. The first plate and the second plate define an interior cavity having a first portion, a pair of second portions, and a pair of third portions. The pair of second portions and pair of third portions surround the first portion. A length of the pair of third portions defines a longitudinal direction and is greater than a width of the pair of second portions. The plurality of heat transfer structures is disposed in the first portion and the plurality of support structures is disposed throughout the interior cavity. A position of the structure length of each of the plurality of heat transfer structures is in line with the longitudinal direction so that working fluid flows from the pair of third portions to and through the first portion unhindered.