Vapor Chamber Heat Dissipation for 3D Semiconductor Stacks
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Solution Overview
Problem
Existing heat dissipation methods for 3-dimensional semiconductor chips, such as vapor chambers and thermal interface materials, are inadequate for effectively cooling the entire stack, particularly for semiconductor dice located at the bottom, due to inefficiencies in heat transfer and structural weaknesses.
Innovation Solution
A semiconductor chip design featuring a vapor chamber filled with coolant, where a cover with a capillary mechanism and net is connected to a plate, and multiple intermediate layers with capillary mechanisms, protuberances, and recesses are alternately arranged with semiconductor dice to enhance heat transfer and circulation, utilizing capillary action and channels to efficiently dissipate heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a pump is used to circulate cooling liquid through channels to carry heat away from the 3-dimensional semiconductor chip, then heat dissipation efficiency is improved, but the device size increases and becomes too big for small semiconductor chips
Solution Approach 1:
The system uses capillary channels that enable self-circulation of coolant without external pumps. The coolant flows through the channels via capillary action, allowing the system to serve itself and eliminating the need for additional pumping components that would increase device size.
Solution Approach 2:
The mechanical pump system is replaced with a passive capillary-based flow system. Instead of using mechanical force to circulate coolant, the invention utilizes capillary forces inherent in the channel structure to drive coolant circulation, thereby eliminating moving parts and reducing device size.
2Loss of energy
If heat-dissipating layers are alternately arranged with semiconductor dice and connected by silicon vias or copper rods, then heat transfer is improved, but the dissipation of heat remains inadequate particularly for semiconductor dice located at the bottom of the stack
Solution Approach 1:
The heat dissipation system is segmented into multiple independent heat-dissipating layers, each associated with specific semiconductor dice. This segmentation allows each layer to efficiently collect and transfer heat from its corresponding dice through capillary channels, ensuring adequate heat dissipation even for dice at the bottom of the stack.
Solution Approach 2:
The invention transitions from vertical heat transfer through vias and rods to a lateral heat transfer approach using capillary channels within intermediate layers. This dimensional change in heat transfer path enables more effective heat collection from multiple dice surfaces and improves overall heat dissipation adequacy.
3Loss of energy
If semiconductor dice are located in a vapor chamber filled with coolant, then heat transfer is enhanced, but the volume of the vapor chamber must be large enough to ensure adequate coolant circulation
Solution Approach 1:
The intermediate layers incorporate capillary channels that function as porous structures for coolant circulation. These capillary channels provide sufficient surface area and flow paths for effective heat transfer without requiring a large vapor chamber volume, as the coolant circulates through the distributed channel network rather than a bulk vapor space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly improves heat dissipation by ensuring efficient heat transfer from semiconductor dice to the cover, where it is dissipated, maintaining structural integrity and enhancing overall cooling efficiency.
Implementation Method 1
The coolant is circulated in the vapor chamber by the capillary mechanism of the cover, the channels and the upper and lower capillary mechanisms of the intermediate layers to transfer heat to the cover from the semiconductor dice
Implementation Method 2
The coolant is vaporized after absorbing heat from the semiconductor dice
Implementation Method 3
The coolant is condensed after transferring the heat to the cover
Implementation Method 4
The efficiency of heat transfer in the intermediate layer influences the efficiency of the dissipation of heat from the vapor chamber
Data Source
AI summary
A semiconductor chip includes semiconductor dice contained in a packaging apparatus including a cover and a plate, thereby forming a vapor chamber. The semiconductor dice and intermediate layers are alternately stacked. A capillary mechanism is provided on a horizontal internal face of the cover. Nets are provided on vertical internal faces of the cover, around the capillary mechanism. Each of the intermediate layers includes protuberances in contact with the nets. A channel is defined between any adjacent two of the protuberances. The channels travel past the intermediate layers. Coolant filled in the vapor chamber is turned into vapor after absorbing heat. The vapor ascends to the cover via the channels. The coolant is returned into liquid after transferring heat to the cover. The liquid descends to the plate. Thus, the coolant is circulated in the vapor chamber. Each of the intermediate layers includes a capillary structure to facilitate the circulation of the coolant.