Vapor Chamber Heat Dissipation for Semiconductor Package
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Solution Overview
Problem
Semiconductor package structures face challenges in efficiently dissipating heat generated during high-speed data transmission due to their small size, leading to performance degradation or failure, as conventional methods like fans and thermal interface materials do not effectively address heat dissipation at the center of the package.
Innovation Solution
Incorporating a vapor chamber thermally connected to the semiconductor die and a heat dissipating device with a liquid flowing channel to create a heat transfer path, where a first working liquid absorbs heat from the die and transfers it to a second working liquid, enhancing heat dissipation efficiency through a circulation loop.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the semiconductor package structure is made small to reduce footprint, then the area occupied is reduced, but heat dissipation efficiency deteriorates
Solution Approach 1:
The vapor chamber is integrated within the package substrate structure, with the semiconductor die mounted on the vapor chamber. The heat dissipating device is then mounted on top of the vapor chamber, creating a nested arrangement where multiple heat dissipation components are stacked vertically within a compact footprint, enabling effective heat dissipation without increasing the package area.
Solution Approach 2:
The invention transitions from planar heat dissipation to three-dimensional heat dissipation by stacking components vertically. The vapor chamber provides thermal pathways through the substrate thickness, and the heat dissipating device extends the thermal management in the vertical dimension, allowing efficient heat removal from a small footprint package.
2Device complexity
If conventional heat dissipation methods (fans, thermal interface materials) are used, then the structure remains simple, but heat dissipation effectiveness at the center of the package deteriorates
Solution Approach 1:
The vapor chamber acts as an intermediary thermal management component between the semiconductor die and the heat dissipating device. It provides a controlled vapor-liquid cycle mechanism that efficiently transports heat from the die center to the heat dissipating device, overcoming the limitations of direct thermal interface materials or fan-based solutions.
Solution Approach 2:
The vapor chamber utilizes phase transitions of the working fluid (evaporation and condensation) to transfer heat. The fluid evaporates at the heated surface near the semiconductor die, absorbs latent heat, transports vapor to the condensation surface, releases heat, and returns as liquid, creating an efficient heat pump effect that dramatically improves heat dissipation effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The vapor chamber and heat dissipating device combination significantly improves heat dissipation efficiency, ensuring even temperature distribution and effective removal of heat from the semiconductor package structure, preventing performance degradation and failure.
Implementation Method 1
The vapor chamber is thermally connected to a first surface of the semiconductor die
Implementation Method 2
The vapor chamber defines an enclosed chamber for accommodating a first working liquid
Implementation Method 3
The heat dissipating device is thermally connected to the vapor chamber
Implementation Method 4
The heat dissipating device defines a substantially enclosed space for accommodating a second working liquid
Data Source
AI summary
A semiconductor package structure includes a package substrate, a semiconductor die, a vapor chamber and a heat dissipating device. The package substrate has a first surface and a second surface opposite to the first surface. The semiconductor die is electrically connected to the first surface of the package substrate. The vapor chamber is thermally connected to a first surface of the semiconductor die. The vapor chamber defines an enclosed chamber for accommodating a first working liquid. The heat dissipating device is thermally connected to the vapor chamber. The heat dissipating device defines a substantially enclosed space for accommodating a second working liquid.