Vapor Chamber Shield Can for Heat Dissipation and EMI
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Solution Overview
Problem
Electronic devices face issues with heat dissipation and electromagnetic interference from components, leading to performance degradation and user discomfort, as existing shield-cans have low thermal heat capacity and fail to effectively manage heat transfer.
Innovation Solution
Incorporating a vapor chamber with a metal surface in electronic devices to absorb heat radiated from components, which also acts as a shield for electromagnetic waves, using a fluid that changes state to facilitate heat dissipation and reduce electromagnetic noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shield-can is used to shield electromagnetic waves, then electromagnetic interference is reduced, but heat dissipation capability deteriorates due to low thermal heat capacity
Solution Approach 1:
The patent changes the material parameters of the shielding structure by filling the shield-can with phase change material (paraffin) and metal powder. This transforms the shield-can from a simple metallic barrier into a composite structure with enhanced thermal properties, allowing it to simultaneously shield electromagnetic waves and dissipate heat through phase change and thermal conduction.
Solution Approach 2:
The invention creates a composite material system by combining the shield-can structure with phase change material and metal powder. This composite structure integrates the electromagnetic shielding function of the metal can with the thermal management function of the phase change material, resolving the contradiction between shielding and heat dissipation.
2Temperature
If heat is dissipated through the shield-can, then thermal management improves, but electromagnetic shielding performance deteriorates
Solution Approach 1:
The patent makes the shield-can multi-functional by integrating three functions into a single structure: electromagnetic shielding (through the metal can and metal powder), heat absorption (through phase change material), and heat dissipation (through thermal conduction). This eliminates the need to choose between shielding and heat dissipation, as both functions coexist in the same component.
3Temperature
If a vapor chamber is used for heat absorption, then thermal management improves, but device complexity increases
Solution Approach 1:
The patent merges the shield-can structure with the vapor chamber function by filling the existing shield-can cavity with phase change material and metal powder. This integration eliminates the need for a separate vapor chamber component, achieving heat absorption functionality while reducing overall device complexity compared to adding a distinct heat absorption component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The vapor chamber effectively lowers the temperature of components, preventing performance degradation and user discomfort while simultaneously shielding electromagnetic waves, thereby enhancing device performance and user experience.
Implementation Method 1
a fluid for absorbing heat radiated from the first and second components is included in the chamber
Implementation Method 2
fluid absorbing heat radiated from the first and second components
Implementation Method 3
by using a vapor chamber having a metal surface, it is possible to shield electromagnetic wave noises generated by a component
Data Source
Figure 1A
Figure 1B
Figure 2A
AI summary
An electronic device according to an embodiment of the present disclosure includes a printed circuit board (PCB), a first component disposed in a first region on the PCB and a second component disposed in a second region on the PCB, and a chamber disposed on the first and second components and having a region including the first and second regions, in which fluid absorbing heat radiating from the first and second components is included in the chamber.