Vapor Chamber with Demountable Shielding Frame for EMI and Heat Dissipation
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Solution Overview
Problem
Existing vapor chambers for electronic devices face high manufacturing costs and complex assembly procedures due to the need for hermetic seals and effective heat transfer, while also failing to adequately address electromagnetic interference (EMI) from electronic components.
Innovation Solution
A vapor chamber design incorporating a capillary structure, supporting structure, and working fluid, along with an extending portion and shielding frame, featuring a coupling structure for demountable assembly and electromagnetic shielding, simplifies manufacturing and assembly while providing effective heat dissipation and EMI protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional vapor chamber with hermetic seal is used for heat dissipation, then heat transfer effectiveness is improved, but manufacturing cost and assembly complexity increase
Solution Approach 1:
The vapor chamber is divided into a body portion and a separate shielding frame portion that can be assembled together. The shielding frame with coupling structures attaches to the vapor chamber body, allowing modular assembly that simplifies manufacturing while maintaining hermetic seal integrity for effective heat dissipation.
2Temperature
If a conventional vapor chamber with hermetic seal is used for heat dissipation, then heat transfer effectiveness is improved, but manufacturing cost increases
Solution Approach 1:
The vapor chamber is divided into a body portion and a separate shielding frame portion that can be assembled together. The shielding frame with coupling structures attaches to the vapor chamber body, allowing modular assembly that simplifies manufacturing while maintaining hermetic seal integrity for effective heat dissipation.
3Object-affected harmful factors
If an electromagnetic mask is used for electromagnetic shielding, then electromagnetic interference prevention is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The invention merges the electromagnetic shielding function with the heat dissipation vapor chamber by integrating a shielding frame made of electromagnetic shielding material directly onto the vapor chamber body. This unified structure simultaneously provides both EMI protection and effective heat dissipation without the need for separate components.
Solution Approach 2:
The vapor chamber structure is designed to perform multiple functions: heat dissipation through the vapor chamber mechanism and electromagnetic shielding through the integrated shielding frame. This multi-functional design eliminates the need for separate EMI masks that would impede heat transfer.
4Ease of operation
If a demountable coupling structure is used for assembly, then ease of assembly and maintenance is improved, but structural integrity may deteriorate
Solution Approach 1:
The coupling structures are pre-designed with precise geometric features (convex and concave portions) that ensure proper alignment and secure connection when assembled. The preliminary design of these coupling features guarantees both ease of assembly and maintained structural integrity through predetermined connection geometry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The vapor chamber achieves efficient heat dissipation and electromagnetic shielding with reduced manufacturing costs and simplified assembly, improving the performance and longevity of electronic components by effectively managing heat and interference.
Implementation Method 1
a vapor chamber with an electromagnetic shielding function, effective in dissipating heat generated from electronic components and equipped with a capillary structure, a supporting structure, and a working fluid
Implementation Method 2
equipped with a capillary structure, a supporting structure, and a working fluid
Implementation Method 3
The shielding frame has a sidewall for surrounding the electronic components on a plane, and a second coupling structure disposed on the sidewall, with the second coupling structure engaged with the first coupling structure, thereby allowing the vapor chamber to demountably cover the electronic component and thus perform the electromagnetic shielding function
Data Source
AI summary
A vapor chamber with electromagnetic shielding function is for dissipating the heat generated by an electronic component. The vapor chamber includes a capillary structure, a support structure, and a working fluid. The vapor chamber includes an extension portion and a frame, and the extension portion extends from the main body of the vapor chamber and has a first coupling structure. The frame has side walls to surround the electronic component in a plane, and a second coupling structure is disposed on each of the side walls. The first coupling structure is engaged with the second coupling structure, so that the vapor chamber detachably covers the electronic component to perform the electromagnetic shielding function.