3D Vapor Chamber Thermal Management for Electronics
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Solution Overview
Problem
Current thermal management systems for electronic devices, particularly in avionics, are thermally limited, leading to reduced processing power and functionality due to overheating, as they struggle to efficiently dissipate heat within size and weight constraints.
Innovation Solution
A thermal management system utilizing a 3D vapor chamber with a precision sintered wick structure and additive manufacturing, which envelops electronics and uses a working fluid to dissipate heat through capillary action, enhancing thermal performance by integrating support structures for structural integrity and fluid transport.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional cooling methods (fans, heatsinks) are used, then heat can be removed from electronic circuitry, but device density increases and packaging reduces while thermal performance becomes limited
Solution Approach 1:
The patent employs phase change materials that undergo phase transitions (solid-liquid-solid) to absorb and dissipate heat from electronic components. The working fluid changes phase in response to thermal loads, enabling high-capacity heat storage and transport without requiring large volume increases, thus resolving the contradiction between processing power and thermal performance.
Solution Approach 2:
The patent utilizes porous wick structures with controlled pore sizes and distributions to transport working fluid through capillary action. These porous materials enable efficient heat transfer while maintaining compact dimensions, allowing increased device density without sacrificing thermal management capability.
2Reliability
If processors are de-rated to avoid overheating, then thermal issues are avoided, but processing capability is drastically reduced
Solution Approach 1:
The phase change material absorbs excess heat during phase transition, maintaining stable operating temperatures for processors without requiring de-rating. This enables processors to operate at full capability while thermal stability is maintained through the latent heat absorption mechanism.
Solution Approach 2:
The working fluid acts as an intermediary between the heat-generating processors and the heat dissipation system. It absorbs heat directly from processors through phase change, then transports and releases heat elsewhere, enabling processors to maintain high performance while thermal stability is ensured by the intermediary heat transfer mechanism.
3Temperature
If vapor chamber size is increased to improve heat dissipation, then thermal performance improves, but system weight increases
Solution Approach 1:
The patent changes the physical parameters of the vapor chamber by using phase change materials with optimized latent heat values and thermal conductivities. This enables high heat dissipation capability in a compact, lightweight design by selecting materials and configurations that maximize thermal performance per unit weight.
Solution Approach 2:
The patent employs composite structures combining porous wicks, phase change materials, and vapor chamber walls with optimized material properties. These composite materials provide high thermal performance while minimizing weight, resolving the contradiction between heat dissipation capability and system weight.
4Manufacturing precision
If additive manufacturing is used to create precision sintered wick structures, then manufacturing complexity increases, but thermal performance and customization improve
Solution Approach 1:
The patent applies local quality by creating wick structures with spatially varying pore sizes, shapes, and distributions optimized for specific thermal management requirements. Additive manufacturing enables this local customization, and while manufacturing complexity increases, the thermal performance benefits justify the process complexity through improved heat transfer efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly improves thermal management by reducing thermal resistance, enabling increased processing power and functionality while maintaining or reducing system weight, with customizable designs and enhanced heat transfer capabilities.
Implementation Method 1
a precision sintered 3D wick structure independently created on at least some of the interior of the vapor chamber, wherein the precision sintered 3D wick structure transports the working fluid by capillary action from at least one working fluid receptacle to the at least a part of the heated portion of the electronics
Implementation Method 2
a working fluid contained within the vapor chamber and used to dissipate heat from at least a part of a heated portion of the electronics
Data Source
Figure 1A~1B
Figure 2~3
Figure 4~5
AI summary
In accordance with one aspect of the invention, a thermal management system for electronics includes a vapor chamber 600 that at least partially envelops the electronics 610, 620, a working fluid contained within the vapor chamber and used to dissipate heat from a part of a heated portion of the electronics and a precision sintered 3D wick structure 650 independently created on some of the interior of the vapor chamber. The precision sintered 3D wick structure 650 transports the working fluid by capillary action from at least one working fluid receptacle to a part of the heated portion of the electronics. In one embodiment of the invention, the 3D vapor chamber may be formed by the additive manufacturing processes. A further example includes precision sintered 3D support structures integrated into the closed 3D vapor chamber. The support structures mainly facilitate to support the 3D closed vapor chamber envelope from collapsing during operation, and add overall structural strength and additionally facilitate transfer of liquids and gas through their internal 3D porous zones.