Vapor Chamber with Local Thickness Variation for Layout Adaptability

Solution Overview

Problem

Vapor chambers in electronic devices face interference issues with other components due to their size and shape, leading to a decrease in heat transport capacity when through holes or notches are formed for compatibility, which compromises their efficiency.

Innovation Solution

A vapor chamber design with a thin portion to avoid interference, featuring a housing with a first region of greater thickness and a second region of lesser thickness, allowing for reduced thickness without significantly impairing heat transport capacity, achieved by adjusting the height of pillars and wick structure configuration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a through hole or notch is formed in the vapor chamber to avoid interference with other components, then the adaptability to device layout is improved, but the heat transport capacity deteriorates due to decreased internal space and cross section of heat transport path

Engineering Contradiction:

Improveadaptability to device layoutVSAvoidheat transport capacity

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The vapor chamber employs varying thickness design where specific local regions have reduced thickness to accommodate other components, while other regions maintain full thickness to preserve heat transport capacity. This local differentiation allows the structure to adapt to device layout requirements without compromising overall thermal performance.

Inventive Principle:

Principle #3Local quality

2Adaptability or versatility

If a through hole or notch is formed in the vapor chamber, then the adaptability to device layout is improved, but the internal space serving as working region decreases

Engineering Contradiction:

Improveadaptability to device layoutVSAvoidinternal space of vapor chamber

Core Design Contradiction:

Adaptability or versatilityVSVolume of moving object

Solution Approach 1:

The vapor chamber employs varying thickness design where specific local regions have reduced thickness to accommodate other components, while other regions maintain full thickness to preserve heat transport capacity. This local differentiation allows the structure to adapt to device layout requirements without compromising overall thermal performance.

Inventive Principle:

Principle #3Local quality

3Adaptability or versatility

If the thickness of vapor chamber is reduced to avoid interference with other components, then the ease of integration with other components is improved, but the mechanical strength may deteriorate

Engineering Contradiction:

Improveease of integration with other componentsVSAvoidmechanical strength

Core Design Contradiction:

Adaptability or versatilityVSStrength

Solution Approach 1:

The vapor chamber employs varying thickness design where specific local regions have reduced thickness to accommodate other components, while other regions maintain full thickness to preserve heat transport capacity. This local differentiation allows the structure to adapt to device layout requirements without compromising overall thermal performance.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design minimizes interference with other components while maintaining effective heat transport, preventing deterioration in vapor chamber performance and simplifying manufacturing.

Implementation Method 1

The wick structure transports the working medium by using capillary forces

Methodology Applied

Scientific EffectCapillary forces: Capillary Action

Implementation Method 2

The working medium absorbs heat at an evaporation section of the vapor chamber that receives heat from a device that generates the heat. The working medium evaporates in the vapor chamber

Methodology Applied

Scientific EffectEvaporation: Evaporation

Implementation Method 3

the vapor chamber can quickly dissipate heat two-dimensionally by utilizing the latent heat of vaporization and condensation of the working medium

Methodology Applied

Scientific EffectLatent heat of vaporization: Latent Heat

Implementation Method 4

The working medium evaporates in the vapor chamber and moves to a condensation section where the working medium is cooled and returns to a liquid phase

Methodology Applied

Scientific EffectCondensation: Condensation

Implementation Method 5

the vapor chamber can quickly dissipate heat two-dimensionally by utilizing the latent heat of vaporization and condensation of the working medium

Methodology Applied

Scientific EffectLatent heat of vaporization and condensation: Latent Heat

Data Source

PatentUS11421942B2Vapor chamber

Publication Date: 2022.08.23 MURATA MFG CO LTD

AI summary

A vapor chamber that includes a housing defining an internal space, and a working medium and a wick structure in the internal space of the housing. As viewed in a plan view, the vapor chamber has a first region with a first thickness and a second region with a second thickness, the second thickness being smaller than the first thickness.