Vapor Chamber Wick Structure for Orientation-Independent Heat Transport

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Solution Overview

Problem

Existing vapor chambers face challenges in maintaining effective heat transport capabilities and preventing dry-out, especially when the installation orientation changes, due to limitations in fluid flow and vapor path design in existing planar heat pipes and vapor chambers.

Innovation Solution

A vapor chamber design featuring a container with a hollow portion between two plate-shaped bodies, a first wick structure with higher flow resistance for liquid phase retention, and a second wick structure on the inner surface with a lattice-shaped groove structure and lower resistance for efficient vapor phase release, ensuring smooth fluid flow and heat transport across different orientations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the vapor flow path is formed by cutout portions in stacked intermediate plates, then liquid capillary flow is enabled, but the structure complexity increases and manufacturing difficulty arises

Engineering Contradiction:
Improvecapillary flow path formationVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the functions of multiple separate components into a single integrated planar wick structure. Instead of using multiple stacked intermediate plates with cutouts, the invention uses a single planar body with two superimposed wick structures, simplifying the overall structure and reducing manufacturing complexity while maintaining both capillary and vapor flow functions.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design allows for superior heat transport capabilities and prevents dry-out by ensuring efficient fluid flow and vapor phase release, maintaining performance regardless of installation orientation, making it suitable for various electronic devices.

Implementation Method 1

a first wick structure provided in the hollow portion; the first wick structure having a higher flow path resistance to the working fluid in liquid phase

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 2

a second wick structure on an inner surface of the one plate-shaped body thermally connected to a heating element; the second wick structure having a lower flow path resistance to the working fluid than the first wick structure

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 3

a vapor flow path is provided inside of the other plate-shaped body

Methodology Applied
Scientific EffectVapor diffusion: Diffusion

Implementation Method 4

a second wick structure on an inner surface of the one plate-shaped body thermally connected to a heating element

Methodology Applied
Scientific EffectPhase change: Phase Change

Implementation Method 5

the working fluid in liquid phase smoothly flows back from the heat releasing portion toward the heat receiving portion

Methodology Applied
Scientific EffectCondensation: Condensation

Data Source

PatentUS10667430B2Vapor chamber
Publication Date: 2020.05.26 FURUKAWA ELECTRIC CO LTD
  • US10667430B2 patent drawing
  • US10667430B2 patent drawing
  • US10667430B2 patent drawing

AI summary

Provided is a vapor chamber that is extremely thin but nonetheless allows a working fluid to smoothly flow back, prevents dry-out and provides a superior heat transport capability, regardless of an installation orientation such as a top heat orientation or a change in the installation orientation. A vapor chamber has a container having a hollow portion, the hollow portion being formed by one plate-shaped body and another plate-shaped body facing the one-plate shaped body; a working fluid enclosed in the hollow portion; a first wick structure provided in the hollow portion; and a second wick structure on an inner surface of the one plate-shaped body thermally connected to a heating element, the second wick structure having a lower flow path resistance to the working fluid than the first wick structure, the second wick structure including a groove portion, wherein a vapor flow path is provided inside of the other plate-shaped body, the first wick structure is provided between the other plate-shaped body and the second wick structure, and an aperture size of the first wick structure is 75% or more of a groove width of the second wick structure and an open area rate of the first wick structure is 35% or more.