Vapor Chamber Wick Protrusions for Open-Path Heat Transport

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Solution Overview

Problem

Existing thermal diffusion devices, such as vapor chambers, face issues with reduced maximum heat transport due to pores in the wick being closed by support structures, impeding smooth gas-liquid exchange and heat transport efficiency.

Innovation Solution

Incorporating through-holes in the wick with protrusions closer to support bodies in the thickness direction, reducing the area where pores are closed, and optionally including additional protrusions to enhance heat transport performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the wick and support structures (props or protruding portions) are joined together to improve strength, then the structural strength is improved, but the pores of the wick are closed which reduces the maximum amount of heat transport

Engineering Contradiction:
Improvestructural strengthVSAvoidheat transport capability
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The support structure is segmented into multiple discrete support portions distributed across the housing surface, rather than a single continuous support structure. This segmentation allows the wick to maintain contact with multiple separate points while preserving pore openness in the interstitial regions between support portions, thus maintaining heat transport capability while providing adequate structural support.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The wick is designed with locally differentiated properties: in regions overlapping support portions, the wick provides structural support, while in regions between support portions, the wick maintains open pores for fluid transport. This local quality differentiation allows different functional requirements to be satisfied in different spatial zones of the same component.

Inventive Principle:
Principle #3Local quality

2Strength

If the wick area in contact with support structures is increased to improve strength, then the structural strength is improved, but the area available for gas-liquid exchange is reduced which causes reduction of maximum heat transport

Engineering Contradiction:
Improvestructural strengthVSAvoidheat transport efficiency
Core Design Contradiction:
StrengthVSProductivity

Solution Approach 1:

The support structure is divided into multiple discrete support portions rather than a continuous structure. This segmentation strategy reduces the total area occupied by support structures, thereby preserving more wick area for gas-liquid exchange while still providing adequate structural support through the distributed arrangement of multiple support points.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The support portions are arranged in a distributed spatial pattern across the housing surface, utilizing two-dimensional spatial arrangement to provide structural support with minimal area occupation. This dimensional approach allows the support structures to be spaced apart, reducing their cumulative footprint on the wick while maintaining structural integrity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves the maximum amount of heat transport by maintaining open pathways for the working medium, enhancing the thermal diffusion device's efficiency and strength.

Implementation Method 1

a wick that transports the working medium with a capillary action

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 2

The working medium absorbs heat from a heating element such as an electronic component at a vaporizing portion that absorbs heat from the heating element, evaporates in the vapor chamber

Methodology Applied
Scientific EffectEvaporation: Evaporation

Implementation Method 3

quickly diffuse heat two-dimensionally using evaporative latent heat and condensed latent heat of the working medium

Methodology Applied
Scientific EffectLatent heat absorption: Latent Heat

Implementation Method 4

moves in the vapor chamber to be cooled, and returns to the liquid phase

Methodology Applied
Scientific EffectCondensation: Condensation

Implementation Method 5

quickly diffuse heat two-dimensionally using evaporative latent heat and condensed latent heat of the working medium

Methodology Applied
Scientific EffectLatent heat release: Latent Heat

Data Source

PatentUS20250227885A1Thermal diffusion device and electronic device
Publication Date: 2025.07.10 MURATA MFG CO LTD
  • US20250227885A1 patent drawing
  • US20250227885A1 patent drawing
  • US20250227885A1 patent drawing

AI summary

A vapor chamber that includes: a housing having a first internal surface and a second internal surface opposing each other in a thickness direction so as to define an internal space; a working medium in the internal space of the housing; a wick in the internal space of the housing; and a first support body in the internal space of the housing between the wick and either one of the first internal surface and the second internal surface of the housing, wherein the wick has one or more through-holes, and wherein the wick, in an area overlapping the first support body, includes: at least one of the one or more through-holes, and a first protrusion that is closer to the first support body in the thickness direction than a peripheral edge of the at least one of the one or more through-holes in the area.