Vapor Chamber Wick Structure for Higher Heat Transport
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Solution Overview
Problem
Existing heat diffusing devices, such as vapor chambers, suffer from reduced heat transport capacity due to insufficient contact between the wick and microchannel structures, leading to inadequate heat distribution.
Innovation Solution
Incorporation of through-holes with protrusions in the wick structure to enhance liquid and vapor flow paths, ensuring better contact with the housing surfaces, thereby improving heat transport efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a wick and microchannel structure are used in a vapor chamber, then heat diffusion capability is improved, but heat transport amount is reduced due to insufficient contact between components
Solution Approach 1:
The wick structure is nested within the microchannel structure, with the wick positioned inside the microchannel cavity. This nested configuration ensures intimate contact between the wick and microchannel surfaces, maximizing the contact area for efficient heat transport while maintaining the heat diffusion capabilities of both structures
Solution Approach 2:
The wick is designed with a porous structure that allows liquid working medium to move through it via capillary action. The porous material provides large surface area for heat exchange and facilitates efficient liquid transport to the evaporation region, resolving the contact insufficiency problem
2Reliability
If the wick is disposed in the internal space of the housing, then heat diffusion is enhanced, but liquid working medium transport to the heat source is insufficient
Solution Approach 1:
The wick is positioned with specific local quality characteristics - it is disposed to contact the microchannel at specific locations where liquid transport is most critical. The wick's porous structure provides localized capillary action zones that efficiently transport liquid to the heat source region while maintaining overall heat diffusion throughout the vapor chamber
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat transport capacity by forming stable liquid and vapor flow paths, increasing the maximum heat transport amount compared to previous designs.
Implementation Method 1
a wick to transport the working medium by capillary force
Implementation Method 2
The working medium absorbs heat from a heat generation element such as an electronic component in an evaporation part that absorbs heat from the heat generation element, thereby evaporates in a vapor chamber
Implementation Method 3
can two-dimensionally diffuse heat at a high speed by using evaporation latent heat and condensation latent heat of the working medium
Implementation Method 4
is cooled, and returns to a liquid phase
Implementation Method 5
can two-dimensionally diffuse heat at a high speed by using evaporation latent heat and condensation latent heat of the working medium
Data Source
AI summary
A heat diffusing device that includes: a housing that includes a first inner surface and a second inner surface facing each other in a thickness direction and defining an internal space; a working medium sealed in the internal space of the housing; and a wick having a sheet shape disposed in the internal space of the housing. The wick includes a first through- hole penetrating the wick in the thickness direction, and a second through-hole penetrating the wick in the thickness direction. A first protrusion protruding toward the first inner surface is on a peripheral edge of the first through-hole. A second protrusion protruding toward the second inner surface is on a peripheral edge of the second through-hole.