Vapor Chamber Wick Structure for Thermal Equalization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current vapor chambers require a support structure, leading to high product thickness, increased production costs, and limited thermal performance, which are bottlenecks in the trend towards thinner and more efficient heat dissipation solutions.
Innovation Solution
A vapor chamber design incorporating a combination of serial and parallel wick structures, allowing for flexible adjustment of the internal wick structure to fit irregular heat sources, with optional features like varying cross-sectional sizes and the use of support columns for stability, while minimizing cross-sectional height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a support structure is disposed between the wick and the second cover, then the structural stability is improved, but the product thickness increases and production costs increase
Solution Approach 1:
The patent removes the traditional support structure from the vapor chamber design. By extracting this component, the patent achieves thinner product thickness while maintaining structural integrity through the optimized serial and parallel wick configurations that inherently provide the necessary support and stability.
Solution Approach 2:
The patent merges the support function into the wick structure itself. The serial and parallel wick configurations are designed to simultaneously serve as both the vapor transfer medium and the structural support element, eliminating the need for separate support structures and reducing overall thickness.
2Stability of the object's composition
If a support structure is disposed between the wick and the second cover, then the structural stability is improved, but production costs increase
Solution Approach 1:
By removing the support structure component, the patent reduces the number of parts that need to be manufactured and assembled, thereby lowering production costs while maintaining structural stability through the integrated wick design.
Solution Approach 2:
The wick structure is designed to perform multiple functions simultaneously - vapor transfer and structural support. This multi-functionality eliminates the need for separate support components, reducing part count and manufacturing complexity, thereby lowering production costs.
3Temperature
If a serial structure is used for the wick, then the temperature equalizing performance is improved, but the cross-sectional height increases
Solution Approach 1:
The patent segments the wick structure into serial and parallel configurations in different regions of the vapor chamber. The serial structure is used where temperature equalization is critical, while the parallel structure is used to reduce cross-sectional height in other areas, achieving an optimal balance between thermal performance and compactness.
Solution Approach 2:
The patent applies different wick structures (serial or parallel) to different local regions of the vapor chamber based on specific thermal requirements. This localized optimization allows the structure to achieve good temperature equalization performance where needed while maintaining compact cross-sectional height in other regions.
4Length of stationary object
If a parallel structure is used for the wick, then the cross-sectional height is reduced, but the temperature equalizing performance decreases
Solution Approach 1:
The patent segments the vapor chamber into regions with different wick configurations. The parallel structure is used in regions where compact cross-sectional height is prioritized, while the serial structure is used in regions where temperature equalization is more critical, achieving a balance between both requirements.
Solution Approach 2:
The patent optimizes the wick structure locally by using parallel configurations where compact height is needed and serial configurations where temperature equalization is prioritized. This local optimization allows the system to achieve both low cross-sectional height and good temperature equalization performance in different regions simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves temperature equalization performance, reduces product thickness, and enhances heat transfer efficiency, supporting irregular shapes and reducing production costs.
Implementation Method 1
a working medium (working medium) is injected into the vapor chamber
Implementation Method 2
The vapor chamber is a vacuum cavity with a fine structure on an inner wall and injected with a working medium
Implementation Method 3
Vapor chamber and electronic device... a vapor chamber (Vapor Chamber, VC) is used to dissipate heat on electronic products
Data Source
Figure 1~2b
Figure 3~3b
Figure 3c~4b
AI summary
Embodiments of this application disclose a vapor chamber and an electronic device. The vapor chamber includes a first cover close to a heat source, and a second cover far from the heat source. The first cover and the second cover form a cavity, the cavity is divided into at least a first cavity and a second cavity, and the first cavity and the second cavity have different cross-sectional sizes. A first wick is disposed in the first cavity, and the first wick has one end connected to the first cover and the other end connected to the second cover. A second wick is disposed in the second cavity, and the second wick is parallel to the first cover. The first wick is connected to the second wick, and the first cavity communicates with the second cavity. A vapor chamber combining a serial structure and a parallel structure can support an irregular structure, so that an internal structure of the wick can be flexibly adjusted based on a shape of a heat source of a product, thereby improving temperature equalizing performance of the vapor chamber.