Systems and methods for vapor-compressed cooling
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Solution Overview
Problem
Existing fluid cooling systems for electronic devices have limited heat removal capacity due to the saturation temperature of the fluid, which restricts the efficiency of condensers in condensing vapor back into liquid.
Innovation Solution
A vapor-compressed liquid cooling system that includes a boiling plate, compressor, and condenser, where the compressor increases the pressure and temperature of the vapor, allowing it to remain saturated at a higher temperature, thereby enhancing the condenser's heat removal capacity by maintaining the vapor in a saturated state at a higher temperature, and a radiator that decreases the temperature and pressure of the liquid to return it to its initial saturation state.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a conventional fluid cooling system is used, then the system can remove heat from electronic components, but the heat removal capacity is limited by the saturation temperature of the fluid
Solution Approach 1:
The patent changes the pressure parameter of the vapor before condensation. By compressing the vapor to increase its pressure, the saturation temperature of the vapor is increased. This allows the condenser to operate at a higher temperature differential, thereby increasing the heat removal capacity without being constrained by the original saturation temperature.
Solution Approach 2:
The patent introduces a compressor as an intermediary component between the evaporator and condenser. This compressor acts as a mediator that modifies the state of the vapor (increasing its pressure and temperature) before it enters the condenser, enabling the condenser to achieve higher heat removal capacity.
2Power
If the condenser operates at higher heat removal capacity, then more heat can be removed from the vapor, but the system complexity increases
Solution Approach 1:
The patent utilizes phase transitions (vapor compression and condensation) as the core mechanism to achieve high heat removal capacity. By leveraging the phase change of the working fluid and the associated latent heat transfer, the system achieves high power capacity without requiring complex heat exchange surfaces or multiple stages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system improves the heat removal capacity of the condenser by maintaining the vapor in a saturated state at a higher temperature, allowing for more efficient heat transfer and potentially reducing the size of cooling components and air flow requirements.
Implementation Method 1
the liquid absorbs heat from the heat-generating electronic component and evaporates into a vapor
Implementation Method 2
The compressor is configured to receive the vapor from the boiling plate and increase a pressure of the received vapor, such that (i) the temperature of the vapor increases and (ii) a saturation temperature of the vapor increases
Implementation Method 3
The condenser is configured to receive the vapor from the compressor and remove heat from the vapor, such that the vapor condenses back into the liquid
Data Source
AI summary
A fluid cooling system includes a boiling plate, a compressor, and a condenser. The boiling plate contacts a heat-generating electronic component. The boiling plate receives a liquid such that the liquid absorbs heat from the electronic component and evaporates into a vapor. The compressor is fluidly connected the boiling plate and receives the vapor of the boiling plate. The compressor increases the pressure of the vapor such that the temperature of the vapor increases, and such that a saturation temperature of the vapor increases. The condenser is fluidly connected to the compressor and the boiling plate. The condenser receives the vapor from the compressor and removes heat from the vapor such that the vapor condenses back into the liquid. The boiling plate receives the liquid from the condenser. The system can include a pump that circulates the liquid and the vapor between the boiling plate, the compressor, and the condenser.