Vapor Compression Chuck for Ion Implanters
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Solution Overview
Problem
Ion implantation systems face challenges with undesired heating of workpieces during the implantation process, which can lead to warping, cracking, and inaccurate ion dosage due to energy buildup, and integrating vapor cooling systems is difficult due to mechanical density constraints in these systems.
Innovation Solution
A vapor compression cooling system is integrated into the ion implantation system, using a thermal controller to send refrigeration fluid through a compressor and condenser to limit or prevent heating, and an electrostatic chuck with a flow restrictor to actively cool the workpiece, ensuring precise temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ion implantation is performed, then dopant elements are implanted into workpieces, but energy builds up in the form of heat causing warping, cracking, and inaccurate ion dosage
Solution Approach 1:
The vapor compression cooling system is activated before ion implantation to pre-cool the workpiece and maintain it at a controlled temperature throughout the implantation process, preventing heat buildup that would cause warping, cracking, and dosage inaccuracies
Solution Approach 2:
A vapor compression cooling system acts as an intermediary between the ion implantation process and the workpiece, using refrigeration fluid circulated through channels in the electrostatic chuck to extract heat and maintain thermal control during implantation
2Temperature
If vapor cooling systems are integrated into ion implanters, then cooling capability is provided, but mechanical density constraints make integration extremely difficult
Solution Approach 1:
The vapor compression cooling system is merged with the existing electrostatic chuck structure by integrating refrigeration fluid channels directly into the chuck body, combining the clamping and cooling functions in a single integrated component rather than adding separate cooling apparatus
Solution Approach 2:
The electrostatic chuck serves multiple functions: it provides electrostatic clamping to hold the workpiece and simultaneously acts as a heat sink through integrated vapor compression cooling channels, eliminating the need for separate cooling systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces undesired heating, maintains thermal uniformity, and minimizes backside particle contamination, ensuring accurate ion implantation and preventing damage to the workpiece.
Implementation Method 1
a thermal controller in the vapor compression system sends refrigeration fluid though a compressor and a condenser according to an ideal vapor compression cycle to help limit or prevent undesired heating of a workpiece during implantation
Implementation Method 2
an electrostatic chuck with a flow restrictor to actively cool the workpiece
Data Source
AI summary
Aspects of the present invention relate to ion implantation systems that make use of a vapor compression cooling system. In one embodiment, a thermal controller in the vapor compression system sends refrigeration fluid though a compressor and a condenser according to an ideal vapor compression cycle to help limit or prevent undesired heating of a workpiece during implantation, or to actively cool the workpiece.