Vapor Deposition Device with Stacked Plate Limiting Unit
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional vapor deposition methods for large-sized substrates face challenges in achieving high-definition patterning due to edge blurring and increased costs, particularly when using large and heavy vapor deposition masks, which complicate handling and require complex equipment, making it difficult to perform mass production efficiently.
Innovation Solution
A vapor deposition device with a limiting unit comprising stacked plate members that separate limiting openings, allowing only vapor deposition particles within a predetermined incidence angle to reach the substrate, thereby reducing edge blurring and enabling the use of smaller masks, and simplifying maintenance by replacing individual plate members rather than the entire unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a large vapor deposition mask is used to cover the entire substrate, then the substrate can be fully covered, but the mask becomes heavy and difficult to handle, and gaps appear due to bending
Solution Approach 1:
The mask is divided into multiple smaller mask units arranged in a matrix pattern. Each mask unit corresponds to a specific region on the substrate and can be independently handled and positioned. This segmentation reduces the weight and size of individual mask components while maintaining complete coverage of the large substrate through coordinated arrangement of multiple units.
2Area of stationary object
If a large vapor deposition mask is used, then complete substrate coverage is achieved, but positioning accuracy decreases due to gaps from mask bending
Solution Approach 1:
Dividing the mask into smaller units reduces bending and improves positioning accuracy for each unit. The multiple mask units can be precisely positioned relative to each other and to the substrate, eliminating the gap issues that occur with large single masks.
Solution Approach 2:
A support structure or frame system is introduced to hold and position the multiple mask units. This intermediary structure ensures accurate positioning and maintains the spatial relationships between mask units during the vapor deposition process, preventing gaps and positioning errors.
3Area of stationary object
If a large vapor deposition mask is used, then the entire substrate can be covered, but the equipment size and complexity increase
Solution Approach 1:
The vapor deposition equipment is configured to handle multiple smaller mask units rather than one large mask. This allows for simpler mask support structures, easier integration with the deposition source, and more manageable equipment design. The system can process multiple mask units through the deposition chamber in an organized manner.
4Productivity
If vapor deposition particles are allowed to reach the substrate from various directions, then deposition efficiency is high, but edge blurring occurs reducing definition
Solution Approach 1:
The vapor deposition process is configured to control the angular distribution of deposition particles differently at different locations. By adjusting the vapor deposition source geometry, position, and orientation, the particle flux is optimized to maintain high deposition efficiency while reducing oblique incidence angles that cause edge blurring. This local optimization of deposition conditions improves pattern definition without sacrificing overall productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient formation of vapor deposition coatings with reduced edge blurring on large substrates at lower costs, improving the reliability and display quality of organic EL display devices by maintaining high definition and reducing production time and equipment complexity.
Implementation Method 1
a vapor deposition source (60) having a plurality of vapor deposition source openings (61), a vapor deposition mask (70) disposed between the plurality of vapor deposition source openings (61) and the substrate (10)
Data Source
AI summary
Vapor deposition particles (91) discharged from at least one vapor deposition source opening (61) pass through a plurality of limiting openings (82) of a limiting unit (80) and a plurality of mask openings (71) of a vapor deposition mask (70), and adhere to a substrate (10) that relatively moves along a second direction (10a) so as to form a coating film. The limiting unit includes a plurality of plate members stacked on one another. Accordingly, it is possible to efficiently form a vapor deposition coating film in which edge blurring is suppressed on a large-sized substrate at a low cost.