Vapor Deposition Mask Blocking Parts for Organic EL Alignment
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Solution Overview
Problem
In organic EL display device manufacturing, the scan vapor deposition method faces challenges with misalignment and color mixing due to the deformation of large vapor deposition masks, limiting the design freedom of the substrate and causing adhesion issues with circuit components.
Innovation Solution
A vapor deposition device with a substrate tray that moves relative to a vapor deposition mask, featuring blocking parts to prevent particle deposition on adjacent regions, allowing for precise deposition of organic EL layers and enabling the arrangement of circuit components without adhesion issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a large vapor deposition mask is used to cover the entire vapor deposition target substrate, then the mask can deposit organic EL layers across the full substrate area, but the mask deforms under its own weight or elongates due to heat, causing misalignment and color mixing
Solution Approach 1:
The patent divides the large vapor deposition mask into multiple smaller mask units arranged in a matrix. Each mask unit corresponds to a specific color (red, green, blue) and deposits organic EL layers for that color in designated pixel regions. This segmentation prevents the deformation and elongation issues that occur with large single masks, as each smaller mask unit maintains structural stability while collectively covering the entire substrate area.
2Manufacturing precision
If the vapor deposition mask is made smaller to avoid deformation, then alignment precision improves, but the mask cannot cover the entire vapor deposition target substrate area
Solution Approach 1:
The patent combines multiple small mask units into a unified mask matrix structure that collectively covers the entire vapor deposition target substrate. The mask matrix includes mask units for red, green, and blue colors arranged in a pattern that corresponds to the pixel regions on the substrate. By merging these smaller precision masks into a coordinated system, the patent achieves both precise alignment (through small individual mask units) and full substrate coverage (through the combined matrix arrangement).
3Length of moving object
If scan vapor deposition is used to deposit organic EL layers, then the vapor deposition mask size can be reduced, but vapor deposition particles may adhere to circuit components in adjacent regions, limiting design freedom
Solution Approach 1:
The patent applies local quality by configuring each mask unit to deposit vapor deposition particles only in specific pixel formation regions corresponding to its color, while deliberately avoiding adjacent regions containing circuit components. The mask units are positioned and sized so that their deposition zones are localized to the intended pixel areas, preventing contamination of circuit components in neighboring regions. This localized deposition approach maintains substrate design freedom while enabling scan vapor deposition with smaller masks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution prevents misalignment and color mixing, enhancing design freedom and allowing circuit components to be placed adjacent to display regions, improving the accuracy and efficiency of organic EL layer deposition.
Implementation Method 1
a vapor deposition source 2 configured to emit vapor deposition particles 40 toward the vapor deposition mask 10
Data Source
AI summary
On a vapor deposition target surface of a vapor deposition target substrate placed on a substrate tray in a vapor deposition device, display regions on which vapor deposition particles are to be deposited are arranged in alignment to be apart from each other in a direction parallel with a scanning direction, and the substrate tray includes a blocking part configured to block the vapor deposition particles to be deposited onto regions adjacent to the display regions in a direction parallel with the scanning direction. This prevents a degree of freedom in designing of the vapor deposition target substrate from being restricted even in performing scan vapor deposition.