In Situ Vapor Deposition Polymerization for Substrate Particle Removal
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Solution Overview
Problem
Current substrate processing systems face difficulties in effectively removing particles from semiconductor substrates due to challenges with polymer-containing, viscoelastic fluids, including cleanliness issues, delivery problems, and inadequate cleaning of deep trenches or high-aspect ratio structures.
Innovation Solution
A method involving vapor deposition polymerization (VDP) to grow a polymer film on the substrate, followed by converting it into a viscoelastic fluid using a solution, which is then used to remove particle contaminants, utilizing initiated chemical vapor deposition (iCVD) and controlling temperature and pressure conditions to enhance adsorption and rheological properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If polymer-containing viscoelastic fluids are used to remove particles, then particle removal capability is improved, but cleanliness and reliability deteriorate due to particulate contamination and metal content problems
Solution Approach 1:
The patent replaces the mechanical delivery system (pumps and tubing) with a vapor-phase polymerization system. Monomers are delivered in vapor form to the substrate, where they polymerize in situ to form viscoelastic fluid directly at the cleaning location, eliminating contamination from mechanical handling and filtration
Solution Approach 2:
The patent uses vapor-phase monomers as intermediaries that convert to viscoelastic polymer fluid on the substrate surface. This intermediary approach allows the polymer to be created only when and where needed, avoiding contamination from storage and transport while maintaining the particle removal benefits
2Object-affected harmful factors
If viscoelastic fluid is pumped through system lines, then particle removal function is maintained, but device complexity and ease of operation worsen due to difficulty in pumping and reliable dispensing
Solution Approach 1:
The patent substitutes the mechanical pumping and dispensing system with a vapor deposition system. Monomers are vaporized and delivered directly to the substrate where they polymerize in situ, eliminating the need for complex pumping infrastructure and ensuring reliable delivery without mechanical failure points
Solution Approach 2:
The system allows the substrate itself to serve as the reaction chamber and polymerization site. The viscoelastic fluid forms automatically on the substrate surface through vapor-phase polymerization, eliminating the need for external pumping, filtering, and dispensing operations
3Object-affected harmful factors
If polymer is used to make viscoelastic fluids, then particle removal capability is enhanced, but manufacturing precision worsens due to difficulty in filtering and particulate contamination
Solution Approach 1:
The patent performs preliminary polymerization in the vapor phase before the polymer contacts the substrate. By forming the polymer directly on the substrate surface from vapor-phase monomers, the system avoids all filtration and handling steps that could introduce contamination, ensuring high cleanliness while maintaining particle removal capability
4Object-affected harmful factors
If viscoelastic fluid is dispensed on substrate, then particle removal is achieved, but manufacturing precision deteriorates due to inability to clean inside deep trenches or high-aspect ratio structures
Solution Approach 1:
The patent transitions from liquid-phase polymer delivery to vapor-phase polymerization. The vapor-phase monomers can penetrate deep trenches and high-aspect ratio structures that liquid viscoelastic fluids cannot access, enabling complete surface coverage and particle removal from complex three-dimensional substrate features
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively removes particle contaminants from substrates by creating a viscoelastic fluid that can penetrate and clean complex structures, improving the efficiency of particle removal and compatibility with semiconductor processing requirements.
Implementation Method 1
supplying a vapor to a processing chamber to grow a polymer film on a substrate in the processing chamber
Implementation Method 2
The vapor further comprises at least one monomer and an initiator. The method includes using a source of energy to decompose the initiator.
Implementation Method 3
adding a solution to the polymer film on the substrate to create a viscoelastic fluid on the substrate
Implementation Method 4
creating a temperature differential between the substrate and other surfaces in the processing chamber while growing the polymer film. The substrate is maintained at a lower temperature than the other surfaces to promote adsorption of the polymer film on the substrate.
Data Source
AI summary
A method for cleaning a substrate includes supplying a vapor to a processing chamber to grow a polymer film on a substrate in the processing chamber; adding a solution to the polymer film on the substrate to create a viscoelastic fluid on the substrate; and removing the viscoelastic fluid to remove particle contaminants from the substrate.