Vapor-Phase Hydrophobing for Substrate Drying
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Solution Overview
Problem
In batch substrate treatment processes, the use of hydrophobic agents for preventing pattern collapse during drying is inefficient due to high consumption quantities when substrates are immersed in hydrophobic agents, leading to increased costs and potential foreign matter generation.
Innovation Solution
A substrate treating method involving a sealed chamber where the substrate is washed, decompressed, and then exposed to a hydrophobic agent vapor for hydrophobing, reducing the need for liquid immersion and minimizing agent usage, with optional steps for organic solvent replacement to manage moisture and prevent pattern collapse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If substrates are immersed into hydrophobic agent for hydrophobing treatment, then pattern collapse is prevented, but hydrophobic agent consumption quantity increases
Solution Approach 1:
The patent applies phase transition by using hydrophobic agent in vapor phase instead of liquid phase for hydrophobing treatment. The vapor-phase treatment achieves the same pattern collapse prevention effect as liquid immersion but with dramatically reduced agent consumption, as the vapor can uniformly coat the substrate surface without requiring excessive liquid material
Solution Approach 2:
The patent utilizes pneumatic principles by introducing hydrophobic agent vapor into the chamber atmosphere and using gas flow to distribute the vapor uniformly across the substrate surface. This vapor-phase pneumatic delivery system replaces the liquid immersion method, achieving effective hydrophobing with minimal agent usage
2Reliability
If substrates are immersed into hydrophobic agent, then hydrophobing treatment is performed, but foreign matter generation increases
Solution Approach 1:
By transitioning from liquid-phase immersion to vapor-phase treatment, the patent eliminates the mechanical contact and pooling of liquid hydrophobic agent that causes foreign matter generation. The vapor-phase deposition is cleaner and leaves minimal residues, thereby reducing foreign matter generation while maintaining treatment effectiveness
3Quantity of substance
If washing liquid remains on substrate surface, then surface tension imbalance occurs, but pattern collapse is caused
Solution Approach 1:
The patent performs preliminary action by conducting hydrophobing treatment before the drying process. This advance treatment modifies the substrate surface properties so that subsequent drying does not cause pattern collapse, even if some washing liquid remains on the surface during the transition
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly reduces hydrophobic agent consumption and minimizes foreign matter generation, effectively preventing pattern collapse during the drying process while maintaining efficient treatment processes.
Implementation Method 1
a hydrophobing treatment can be performed on the substrate surface by exposing the substrate to the atmosphere of the hydrophobic agent
Implementation Method 2
a decompression step of decompressing an inside of the chamber
Data Source
AI summary
A substrate treating method dries a substrate on a surface of which a predetermined pattern is formed. The substrate treating method includes: a washing step of washing the substrate by immersing the substrate into a washing liquid after the washing liquid is stored into the treating tank in a sealed chamber; a decompression step of decompressing an inside of the chamber; a lifting step of lifting the substrate from the washing liquid stored in the treating tank; a liquid discharge step of discharging the washing liquid from the treating tank; and a hydrophobing step of replacing an atmosphere in the chamber with a hydrophobic agent and performing a hydrophobing treatment on the surface of the substrate.