Vapor Passthrough Conduit for Parallel Two-Phase Chip Cooling
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Solution Overview
Problem
Current cooling technologies for data centers and electronic components are inadequate for handling the intense heat loads of modern processors, leading to inefficiencies, high costs, and safety risks, and traditional methods introduce communication latencies and corrosion issues.
Innovation Solution
A two-phase cooling system utilizing Enhanced Nucleation Evaporators (ENE), Heat Rejection Units (HRU), and Refrigerant Distribution Units (RDU) for direct-on-chip cooling, employing non-aqueous dielectric coolants and condensers to manage heat transfer and circulation without water, with integrated sensors and processors for control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional water-based cooling techniques are used, then cooling effectiveness is improved, but risk of short-circuiting and corrosion increases
Solution Approach 1:
The patent introduces a dielectric liquid as an intermediary cooling medium that transfers heat away from electronic components without conducting electricity. This mediator substance provides the cooling effectiveness of liquid cooling while eliminating the electrical conductivity problem that causes short-circuiting and corrosion in traditional water-based systems.
2Temperature
If air conditioning units are installed inside data centers, then cooling capacity is improved, but cost increases significantly
Solution Approach 1:
The patent extracts the cooling function from complex air conditioning systems and implements it directly at the heat source through dielectric liquid cooling channels integrated with electronic components. This removes the need for large, expensive air conditioning infrastructure while maintaining effective cooling capacity.
Solution Approach 2:
The dielectric liquid cooling system provides self-contained cooling directly at the electronic components through integrated cooling channels. The system serves itself by having the dielectric liquid circulate through channels in direct thermal contact with heat-generating components, eliminating the need for external air conditioning units.
3Device complexity
If data centers are located in cool climates or adjacent to bodies of water, then cooling cost is reduced, but communication latency increases
Solution Approach 1:
The dielectric liquid cooling system enables data centers to be self-sufficient regarding cooling requirements. The integrated cooling channels with dielectric liquid provide localized cooling that does not depend on external environmental conditions, allowing data centers to be located anywhere without incurring additional cooling costs or experiencing communication latency.
4Device complexity
If older cooling technologies are used, then cost is reduced, but cooling effectiveness is inadequate for high-performance processors
Solution Approach 1:
The patent changes the key parameter of coolant electrical conductivity by using dielectric liquids instead of conventional conductive coolants. This parameter change enables effective cooling of high-performance processors while preventing electrical short-circuiting, achieving both cooling effectiveness and safety without requiring older, less effective cooling technologies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively manages heat generation in electronic components, reducing costs and safety risks while maintaining performance by providing efficient, safe, and reliable cooling without the need for air conditioning or water-based systems.
Implementation Method 1
A dielectric liquid may be circulated through channels formed in an enhanced nucleation evaporator thermally coupled to a heat-generating electronic component
Implementation Method 2
enhanced nucleation evaporator
Implementation Method 3
A dielectric liquid may be circulated through channels formed in an enhanced nucleation evaporator thermally coupled to a heat-generating electronic component
Implementation Method 4
The vaporized dielectric liquid may be flow communicated to a condenser configured to convert the vaporized dielectric liquid to a liquid state
Implementation Method 5
a condenser configured to convert the vaporized dielectric liquid to a liquid state
Data Source
AI summary
A cooling device configure for parallel liquid coolant interconnection and serial vapor return interconnection comprising: a chamber having a liquid coolant region and vaporized coolant region; a liquid coolant port in the chamber for flow connection to a liquid coolant source; a first vapor port in the chamber for evacuating first vaporized coolant from the chamber; a second vapor port in the chamber for receiving second vaporized coolant from at least one other chamber of at least one other two-phased cooling device; and a vapor passthrough path flow-connecting the first vapor port to the second vapor port, to thereby enable the second vaporized coolant to mix with the first vaporized coolant.