Ultrathin Vapor-Phase Adhesive for LED Thermal Management
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Solution Overview
Problem
Conventional methods for producing optic devices, such as LED chips, face challenges in achieving low thermal resistance due to thick adhesive layers, which hinder heat dissipation and package-level performance.
Innovation Solution
The method involves applying an ultrathin adhesive layer using physical or chemical vapor phase deposition, composed of organic materials like polymers, to reduce thermal resistance between the optic device and its support, enhancing heat dissipation and package performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conventional liquid-based adhesive layer is applied to the optic device, then the adhesive layer provides sufficient bonding strength, but the thermal resistance increases and heat dissipation deteriorates
Solution Approach 1:
The patent changes the thickness parameter of the adhesive layer from conventional micrometer scale (1-10 μm) to ultrathin nanometer scale (20-500 nm). This parameter change reduces the thermal resistance pathway while maintaining bonding strength through enhanced interfacial contact and adhesion mechanisms in the ultrathin regime.
Solution Approach 2:
The patent replaces liquid-based adhesive application (stamping, jetting, spin-coating) with vapor phase deposition methods (PVD, CVD). This substitution eliminates fluidic phase processes and surface tension effects, enabling precise thickness control and homogeneous coverage without the thermal and mechanical drawbacks of liquid adhesives.
2Temperature
If the adhesive layer thickness is reduced to improve heat dissipation, then thermal resistance decreases, but manufacturing precision and homogeneity become more difficult to achieve
Solution Approach 1:
The patent replaces mechanical/liquid-based adhesive application with vapor phase deposition (PVD, CVD). These deposition methods provide atomic-layer precision and excellent thickness uniformity across the substrate, enabling reliable control of ultrathin adhesive layers (20-500 nm) that would be impossible to achieve with conventional liquid-based methods.
Solution Approach 2:
The patent transitions from micrometer-scale thickness control to nanometer-scale precision through vapor phase deposition. This parameter change in thickness control capability, enabled by the deposition process, allows achieving the target 20-500 nm range with high precision and homogeneity.
3Temperature
If vapor phase deposition is used to apply the adhesive layer, then the thermal resistance is reduced and heat dissipation improves, but the manufacturing process complexity increases
Solution Approach 1:
The patent merges the adhesive application process with existing vapor phase deposition infrastructure used for other semiconductor and optoelectronic device manufacturing steps. By utilizing established PVD/CVD equipment and process knowledge, the additional complexity is minimized while achieving the benefits of ultrathin adhesive layers.
4Ease of manufacture
If conventional stamping or jetting processes are used to apply the adhesive layer, then the manufacturing process is simpler, but the adhesive layer thickness is too thick and thermal resistance increases
Solution Approach 1:
The patent replaces simple but thick liquid-based adhesive application (stamping, jetting) with vapor phase deposition. Although PVD/CVD equipment is more complex, the process eliminates the need for thick adhesive layers by depositing material in vapor phase, directly forming ultrathin (20-500 nm) uniform layers that liquid methods cannot achieve without being excessively thick.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a robust, homogeneous, and reproducible adhesive layer with significantly reduced thermal resistance, improving the heat dissipation and package-level performance of optic devices like LED chips.
Implementation Method 1
the adhesive layer is applied by physical vapor phase deposition, PVD for short
Implementation Method 2
the adhesive layer is applied by physical vapor phase deposition, PVD for short, or by chemical vapor phase deposition, CVD for short
Data Source
AI summary
A method for producing an optic device, an optic device and an assembly including such an optic device are disclosed. In an embodiment, the method includes providing an active medium mechanically carried by a carrier body or included in the carrier body; applying an adhesive layer to at least one of the active medium or the carrier body, wherein the adhesive layer comprises at least one organic material and is applied by physical or chemical vapor phase deposition, and wherein a thickness of the adhesive layer is between 20 nm and 0.6 μm inclusive.