Vaporizable Source Material Container Corrosion Resistance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Vaporizable source material containers, particularly those using stainless steel or Hastelloy, suffer from insufficient corrosion resistance when exposed to reactive metal halides, leading to impurity contamination in thin film deposition processes, which is exacerbated by the generation of acid gases like hydrogen chloride, necessitating improved measures to maintain high purity in semiconductor products.
Innovation Solution
A vaporizable source material container with a double-wall structure and a gas introduction pipe made from the same high-purity metal as the metal halide, combined with fluorocarbon polymer or ceramic coatings and electrolytic polishing, to minimize corrosion and impurity incorporation, ensuring excellent corrosion resistance and high-purity vaporization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If stainless steel is used for the container wall, then thermal conductivity is improved, but corrosion resistance deteriorates
Solution Approach 1:
The container is divided into an inner container and an outer container, with the inner container made of corrosion-resistant material (quartz glass or Teflon) and the outer container made of thermally conductive material (stainless steel). This segmentation allows each part to fulfill its specific function without compromising the other.
Solution Approach 2:
A Teflon coating is applied to the inner surface of the container to act as an intermediary layer between the metal halide and the container wall. This coating prevents direct contact between the corrosive metal halide and the stainless steel, thereby maintaining both thermal conductivity and corrosion resistance.
2Strength
If stainless steel or Hastelloy is used for the container, then structural strength is improved, but impurity contamination increases
Solution Approach 1:
The container is segmented into inner and outer parts, with the inner container made of highly pure materials (quartz glass or Teflon) that do not contaminate the metal halide, while the outer container provides structural strength. This ensures the vaporizable source material remains free from impurity contamination.
Solution Approach 2:
The Teflon coating serves as an intermediary barrier that prevents direct interaction between the metal halide and the container wall, eliminating the source of impurity contamination while allowing the container to maintain its structural integrity.
3Productivity
If metal halides are used as vaporizable source material, then reactivity for thin film deposition is improved, but corrosion of the container increases
Solution Approach 1:
The container structure is segmented into an inner corrosion-resistant container and an outer protective container, allowing the use of reactive metal halides in the inner container without compromising the outer container's integrity.
Solution Approach 2:
The Teflon coating acts as an intermediary protective layer that enables the use of highly reactive metal halides for efficient thin film deposition while preventing these reactive materials from corroding the container wall.
4Manufacturing precision
If higher purity materials are used for the container, then impurity incorporation is reduced, but manufacturing complexity increases
Solution Approach 1:
The container is segmented into inner and outer parts with different material requirements. The inner container uses high-purity materials (quartz glass or Teflon) to prevent contamination, while the outer container can use standard stainless steel for structural support, thereby achieving high purity without excessive manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces impurity incorporation and enhances corrosion resistance, allowing for the production of high-purity thin films with reduced contamination from the container materials, meeting the stringent purity requirements for semiconductor products.
Implementation Method 1
a mixed gas which is the mixture of the metal halide for thin film deposition vaporized into a gas state in the inner container by heating and the carrier gas entered into the inner container
Implementation Method 2
electrolytic polishing
Data Source
AI summary
Provided are a vaporizable source material container with excellent corrosion resistance and a solid vaporization supply system. A vaporizable source material container for storing and vaporizing a metal halide for thin film deposition as a vaporizable source material includes an inner container accommodated in an outer container constituting a double-wall structure with the outer container, a lid body including an inner lid detachably fixed to the inner container and an outer lid configured detachably fixed to the outer container, and a gas introduction pipe connected to a carrier gas inlet disposed in the lid body, The portions in contact with the metal halide for thin film deposition in a state of gas or solid of the inner container, the outer container, and the gas introduction pipe are made of the same metal material as the metal halide for thin film deposition, which has a purity of 2N to 6N.