Variable Adhesion Release Film for Display Assembly
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Solution Overview
Problem
In display devices using organic or inorganic electroluminescent (EL) or light-emitting diode (LED) technology, dust often enters between films during assembly, necessitating frequent peeling and reassembly to improve yield and prevent damage to the organic EL devices.
Innovation Solution
The implementation of adhesion-variable adhesive layers that can be selectively reduced in adhesion strength, allowing for the controlled peeling and reattachment of auxiliary bases and polarizers without damaging the organic EL devices, using techniques such as cooling, heating, or ultraviolet radiation to manage the adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If films are stuck together during assembly, then manufacturing progress continues, but dust enters between films requiring peeling and reassembly
Solution Approach 1:
A release film is introduced as an intermediary layer between the auxiliary base and the organic EL device. This release film allows controlled peeling and reattachment by managing adhesion strength, enabling dust removal and reassembly without damaging the organic EL device while maintaining manufacturing progress
Solution Approach 2:
The adhesion strength of the adhesive layer is made variable through parameter changes such as temperature control. By adjusting temperature, the adhesion strength can be reduced for easy peeling when dust is detected, and increased for secure bonding during normal assembly, thus resolving the contradiction between maintaining assembly progress and preventing dust contamination
2Reliability
If peeling is performed to remove dust, then dust-free assembly is achieved, but organic EL devices may be damaged
Solution Approach 1:
The release film serves as a mediator that absorbs the mechanical stress during peeling. By positioning the release film between the auxiliary base and the organic EL device, it prevents direct contact and potential damage to the fragile organic EL device during the peeling process, while still allowing effective dust removal
Solution Approach 2:
The adhesive layer is designed with controllable adhesion strength that provides cushioning protection beforehand. When peeling is required, the adhesion strength is reduced in advance through temperature control or other means, ensuring that the peeling force does not exceed the damage threshold of the organic EL device while still being sufficient to remove dust
3Ease of repair
If adhesion strength is reduced for peeling, then ease of repair is improved, but bonding strength during operation may be insufficient
Solution Approach 1:
The adhesion strength of the adhesive layer is made dynamic rather than static. Through temperature control or other external stimuli, the adhesion strength can be dynamically adjusted: reduced when peeling or repair is needed, and increased when secure bonding is required for operation. This dynamic property resolves the contradiction between ease of repair and bonding strength
Solution Approach 2:
Physical or chemical parameters of the adhesive layer are changed to control adhesion strength. For example, temperature changes can transition the adhesive between a soft, low-adhesion state for peeling and a hard, high-adhesion state for bonding. This parameter control enables both easy repair and sufficient bonding strength at different stages
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the repeated peeling and reattachment of auxiliary bases and polarizers while minimizing damage to the organic EL devices, preventing dust entry and maintaining the integrity of the display device, thus improving manufacturing efficiency and yield.
Implementation Method 1
using techniques such as cooling, heating, or ultraviolet radiation to manage the adhesion
Implementation Method 2
using techniques such as cooling, heating, or ultraviolet radiation to manage the adhesion
Implementation Method 3
using techniques such as cooling, heating, or ultraviolet radiation to manage the adhesion
Data Source
AI summary
According to one embodiment, a display device includes a first insulating substrate, an emitting layer, a protective film, a resin base, a first adhesive layer, and a second adhesive layer. The first insulating substrate includes a display area and a drive area. The emitting layer is in the display area. The protective film covers the emitting layer. The resin base is at a position upper than the protective film. The first adhesive layer is under the resin base, in the display area and the drive area. The second adhesive layer is on the resin base. The second adhesive layer covers the drive area and an end portion of the resin base. The resin base is located between the first adhesive layer and the second adhesive layer in the drive area.