Variable Airflow Resistance for Cooling Recirculation Control

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Solution Overview

Problem

Electronic equipment in enclosures can suffer from thermal damage due to inadequate heat transfer, particularly when re-circulation of heated air occurs, especially in scenarios like fan failure, which impairs airflow and cooling efficiency.

Innovation Solution

A cooling system with a controllable airflow resistance apparatus, comprising sensors and a controller, that detects airflow conditions and adjusts airflow resistance to prevent recirculation by managing airflow paths and fan operations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If airflow paths are fixed and simple, then device complexity is reduced, but airflow recirculation occurs causing thermal damage

Engineering Contradiction:
Improveairflow path structureVSAvoidthermal damage from recirculation
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

The patent implements variable airflow resistance elements that can dynamically adjust their resistance levels based on real-time airflow conditions detected by sensors. This allows the system to adapt airflow paths dynamically rather than using fixed paths, preventing recirculation while maintaining manageable device complexity through controlled adaptability.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system incorporates sensors that detect airflow conditions and feed this information back to controllers, which then adjust the variable airflow resistance elements accordingly. This closed-loop feedback mechanism enables the system to automatically prevent thermal damage from recirculation without requiring complex manual design of all possible airflow scenarios.

Inventive Principle:
Principle #23Feedback

2Reliability

If controllable airflow resistance is added to manage recirculation, then thermal management reliability is improved, but device complexity increases

Engineering Contradiction:
Improvethermal managementVSAvoidairflow control system
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent changes the resistance parameter of airflow paths using variable resistance elements that can adjust their flow resistance characteristics. This allows the system to improve thermal management reliability by controlling recirculation while adding only moderate complexity through parameter adjustment rather than complex structural changes.

Inventive Principle:
Principle #35Parameter changes

3Device complexity

If fixed airflow paths are used, then device complexity is minimized, but heat transfer efficiency deteriorates due to recirculation

Engineering Contradiction:
Improveairflow control structureVSAvoidheat transfer efficiency
Core Design Contradiction:
Device complexityVSLoss of energy

Solution Approach 1:

The system uses dynamic airflow resistance control to optimize heat transfer efficiency by preventing hot air recirculation back to heat-generating components. This maintains effective heat transfer while adding minimal structural complexity compared to completely fixed airflow paths.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS8720532B2Controllable flow resistance in a cooling apparatus
Publication Date: 2014.05.13 HEWLETT PACKARD ENTERPRISE DEV LP
  • US8720532B2 patent drawing
  • US8720532B2 patent drawing
  • US8720532B2 patent drawing

AI summary

An airflow control apparatus includes a controllable airflow resistance aligned with an airflow path of a plurality of airflow paths, a sensor capable of detecting an airflow condition in at least one of the plurality of airflow paths, and a controller. The controller is coupled to the controllable airflow resistance and to the sensor, and can control the controllable airflow resistance to manage airflow recirculation based on the airflow condition detected by the sensor.