Wafer Edge Polishing Drum With Variable-Angle Surface for Uniform Bevels
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing edge polishing technologies for wafers result in non-uniform shape variations in the polished edge area due to the use of edge polishing drums with fixed shapes and angles, leading to inconsistencies in the polished edge of the wafer.
Innovation Solution
A wafer edge polishing drum with a variable-angle inner surface and tilted rotation axes, allowing for uniform polishing of the edge area by adjusting the angle of the polishing part and rotating the wafer and polishing drum in a controlled manner.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a fixed-shaped edge polishing drum is used, then the device structure is simple, but the polished edge area has shape variation and non-uniformity
Solution Approach 1:
The polishing drum employs a variable-angle inner surface where the second angle relative to the first surface can be adjusted or varied. This dynamic angle configuration allows the polishing contact surface to adapt to different edge regions (edge front bevel and edge back bevel), enabling uniform polishing across the entire edge area while maintaining a relatively simple drum structure without complex mechanical adjustment mechanisms.
2Manufacturing precision
If a uniform-shaped polishing drum is used, then the device is easy to manufacture, but it cannot uniformly polish non-uniform edge areas of the wafer
Solution Approach 1:
The polishing drum's inner surface is designed with differentiated regions: a first surface extending from the wafer's first surface and a second surface contacting the edge area, with the second surface having a variable second angle. This local quality variation in the drum's geometry allows each region of the drum to be optimized for polishing specific edge regions, achieving consistent edge polishing results while using conventional manufacturing methods for each section.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures uniform polishing of both the edge front and back bevels, reducing shape variations and achieving a consistent edge shape on the wafer.
Implementation Method 1
a second surface formed so as to be brought into contact with an edge area of a wafer
Implementation Method 2
edge polishing process is performed to mirror-polish a rough surface in the edge area of the wafer
Data Source
AI summary
Disclosed are a wafer edge polishing drum and wafer edge polishing equipment including the same. The wafer edge polishing drum includes a body part having a disc shape and a polishing part extending from a peripheral portion of a first surface of the body part while being inclined with respect to the first surface of the body part. The polishing part includes an inner surface surrounding a polishing area adjacent to the first surface of the body part. The inner surface of the polishing part includes a first surface extending from the first surface of the body part and a second surface formed so as to be brought into contact with an edge area of a wafer. The second surface of the polishing part has a second angle with respect to the first surface of the body part, and the second angle is variable.