Variable Anneal Chamber Count for Semiconductor Substrate Treating
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Solution Overview
Problem
Semiconductor manufacturing equipment often has fewer anneal chambers than process chambers, leading to unit per equipment hour (UPEH) deterioration due to the shorter anneal process time, resulting in insufficient heat treatment capacity.
Innovation Solution
A substrate treating apparatus with a variable number of heat treatment chambers, where the number of first chambers (for anneal processes) is adjusted based on the number of second chambers (for other processes) needed, determined by process by-products generation, temperature, and material type, with a transfer chamber and buffer units for efficient substrate movement and temporary storage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the number of anneal chambers is reduced to lower equipment cost, then equipment investment is reduced, but heat treatment capacity becomes insufficient leading to UPEH deterioration
Solution Approach 1:
The process chamber is designed to perform multiple functions: it can conduct both process treatments (etching, deposition, etc.) and heat treatment processes. By equipping the process chamber with a heating mechanism and controlling it to operate as a heat treatment chamber when anneal chambers are unavailable, the system achieves multi-functionality. This allows the same chamber to serve dual purposes, thereby maintaining heat treatment capacity without increasing the number of dedicated anneal chambers.
Solution Approach 2:
The system dynamically adjusts the function of chambers based on real-time demand. When anneal chambers are occupied or unavailable, the process chamber is dynamically converted to perform heat treatment. This dynamic reconfiguration ensures that heat treatment capacity adapts to varying process requirements, preventing UPEH deterioration while avoiding the need for fixed additional anneal chambers.
2Device complexity
If the number of anneal chambers is reduced, then equipment complexity is reduced, but substrate waiting time increases due to insufficient heat treatment capacity
Solution Approach 1:
The process chamber serves dual purposes as both a process treatment chamber and a heat treatment chamber. This multi-functionality eliminates the need for separate dedicated anneal chambers for all processes, reducing equipment complexity while ensuring that heat treatment capacity is available when needed, thereby preventing substrate waiting time increases.
Solution Approach 2:
The system ensures continuous heat treatment capability by having the process chamber available to perform heat treatment whenever anneal chambers are unavailable. This continuity of useful action prevents interruptions and substrate waiting time, as there is always at least one chamber capable of performing heat treatment processes.
3Productivity
If process chambers are used for heat treatment, then heat treatment capacity is increased, but process treatment capacity may be reduced
Solution Approach 1:
The process chamber dynamically switches between process treatment and heat treatment functions based on real-time demand. When heat treatment is needed and anneal chambers are unavailable, the process chamber is converted to heat treatment mode. When process treatments are needed, it returns to process treatment mode. This dynamic switching ensures both heat treatment capacity and process treatment capacity are maintained according to actual requirements.
Solution Approach 2:
The system changes operational parameters of the process chamber to switch between functions. By adjusting temperature parameters and process conditions, the same chamber can operate as a process treatment chamber or a heat treatment chamber. This parameter-based flexibility allows the chamber to adapt to different process requirements without permanent structural modifications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration optimizes the use of heat treatment chambers, reducing UPEH deterioration by ensuring appropriate heat treatment capacity matches process demands, improving efficiency and reducing downtime.
Implementation Method 1
a first chamber heat-treating a substrate
Data Source
AI summary
A substrate treating apparatus and a substrate treating system including the same are disclosed, in which the number of heat treatment chambers such as anneal chambers may be varied. The substrate treating apparatus includes a first chamber heat-treating a substrate; and a second chamber treating the substrate in another way different from heat-treatment, wherein the number of the first chambers is varied depending on the number of the second chambers that need heat treatment for the substrate.