Variable Antenna Size for Uniform Plasma Density in Substrate Treatment
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Solution Overview
Problem
Existing substrate treatment processes using plasma often result in uneven plasma density distribution due to asymmetrical plasma generation, leading to inconsistent substrate treatment.
Innovation Solution
A substrate treatment apparatus with a variable antenna size and shape, comprising multiple antenna frames and connecting members, allows for the adjustment of antenna size and position to achieve uniform plasma density distribution by applying high-frequency power and controlling the plasma generation process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a fixed shape antenna is used, then the antenna structure is simple, but the plasma density distribution becomes asymmetrical and uneven
Solution Approach 1:
The antenna structure is made dynamically adjustable by allowing the antenna frame to change its shape and size. The antenna includes multiple antenna frames that can be repositioned relative to each other, enabling the antenna to adapt its geometry to achieve symmetrical plasma density distribution while maintaining manageable structural complexity.
Solution Approach 2:
The antenna operating parameters are changed by varying the antenna frame configuration. By adjusting the position and arrangement of antenna frames, the electromagnetic field distribution is optimized to produce symmetrical plasma density, thereby improving substrate treatment uniformity without requiring a completely complex fixed structure.
2Ease of operation
If the antenna size is fixed, then the device is simpler to operate, but the substrate treatment uniformity is poor
Solution Approach 1:
The antenna system incorporates adjustable antenna frames that can be repositioned to optimize plasma symmetry for different substrate sizes and treatment requirements. This dynamic adjustability maintains ease of operation while significantly improving substrate treatment uniformity through optimized electromagnetic field distribution.
Solution Approach 2:
The antenna is designed with multiple configurable frames that can be arranged in various configurations to accommodate different substrate sizes and treatment needs. This multi-functional design allows a single antenna system to achieve uniform plasma distribution across multiple operating conditions without requiring multiple fixed antennas.
3Manufacturing precision
If symmetrical plasma density is achieved through variable antenna, then substrate treatment uniformity improves, but the antenna structure becomes more complex
Solution Approach 1:
The antenna is segmented into multiple independent antenna frames that can be individually positioned and adjusted. This segmentation allows each frame to be optimized independently while working together to create symmetrical plasma density distribution, achieving improved substrate treatment uniformity without requiring an overly complex monolithic structure.
Solution Approach 2:
The antenna frames are arranged in a nested or hierarchical configuration where smaller frames are positioned within or between larger frames. This nesting approach allows compact arrangement of multiple adjustment elements, achieving symmetrical plasma distribution while minimizing the overall structural footprint and complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus ensures a uniform substrate treatment process by adjusting the plasma density distribution, enhancing the consistency and effectiveness of plasma-based processes such as etching.
Implementation Method 1
an antenna configured to supply high frequency power into the process chamber to excite the process gas within the process chamber
Implementation Method 2
Plasma is generated at very high temperature or by strong electric fields or radio frequency (RF) electromagnetic fields, and is denoted as an ionized gas state formed of ions, electrons, or radicals
Data Source
AI summary
Provided is a substrate treating apparatus, which includes a process chamber having an inner space, a substrate support part disposed within the process chamber, and supporting a substrate, a gas supply part supplying a process gas into the process chamber, an antenna configured to supply high frequency power into the process chamber to excite the process gas within the process chamber, and a driving part varying a size of the antenna.