Variable Aperture Shield for Wafer Plating Uniformity
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Solution Overview
Problem
Current wafer carriers with fixed-size shields require manual swapping for varying plating parameters, leading to inefficiencies and errors in achieving uniformity during electroplating, and are costly to produce.
Innovation Solution
A wafer carrier with a variable aperture shield comprising a fixed base plate and rotating fins that adjust to change the exposed area, allowing for automated and efficient size adjustments without the need for multiple shields.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple fixed-size shields are used to achieve plating uniformity, then plating uniformity is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent transforms the static fixed-size shields into a dynamic adjustable shield system. The shield aperture diameter can be continuously adjusted from 150mm to 350mm using a drive mechanism that rotates the shield plate, changing the aperture radius. This dynamic adjustment eliminates the need for multiple fixed-size shields while maintaining plating uniformity across different wafer sizes.
Solution Approach 2:
The single adjustable shield performs multiple functions that previously required multiple specialized shields. By making the shield aperture variable, one shield structure can accommodate different plating parameters and wafer sizes, replacing the need for multiple fixed-size shields and reducing device complexity.
2Manufacturing precision
If multiple fixed-size shields are swapped manually to match plating parameters, then plating precision is improved, but productivity and operation time increase
Solution Approach 1:
The shield transitions from requiring manual swapping of multiple fixed components to a single dynamically adjustable component. The drive mechanism enables continuous adjustment of the aperture diameter, allowing operators to quickly adapt to different plating parameters without time-consuming manual shield changes, thus improving productivity.
Solution Approach 2:
Instead of changing physical shields, the system changes the aperture parameter dynamically. The aperture radius can be adjusted from 75mm to 175mm by rotating the shield plate, allowing rapid adaptation to different plating requirements without manual intervention for shield replacement.
3Adaptability or versatility
If multiple fixed-size shields are used, then adaptability to different plating parameters is improved, but ease of operation deteriorates due to manual swapping
Solution Approach 1:
The system replaces the operation of manually swapping multiple shields with a single rotational adjustment operation. The drive mechanism allows the aperture diameter to be changed by rotating the shield plate, which is operationally simpler and more intuitive than identifying, removing, and installing different fixed-size shields.
Solution Approach 2:
Multiple fixed-size shields are merged into a single adjustable shield structure. The variable aperture mechanism combines the functions of multiple shields into one component, simplifying the operational process from multiple discrete actions (selecting, removing, installing shields) to a single continuous adjustment action.
4Adaptability or versatility
If multiple fixed-size shields are manufactured, then versatility for different exposed areas is improved, but manufacturing cost increases
Solution Approach 1:
Instead of manufacturing multiple specialized shields for different exposed areas, a single universal shield with variable aperture is produced. The adjustable mechanism allows one shield to provide the functionality of multiple fixed-size shields, significantly reducing manufacturing costs while maintaining versatility.
Solution Approach 2:
The shield incorporates a dynamic adjustment mechanism that allows the aperture size to vary from 150mm to 350mm diameter. This dynamic capability replaces the need for multiple static shield components, reducing manufacturing complexity and cost while providing the same versatility.
Data Source
AI summary
A wafer carrier is described. In one embodiment, the wafer carrier includes a variable aperture shield.


