Variable Thickness Bonding Leads for OLED Panel Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current display devices, particularly liquid crystal display devices, require additional light sources and have limitations in thickness, weight, power consumption, and response speed, whereas OLED display devices excel in these aspects but face challenges in miniaturization and integration.
Innovation Solution
The design incorporates a display panel with panel bumps and bonding leads of varying thicknesses on a flexible circuit film, connected to a chip and circuit board, allowing for a compact and efficient electrical connection that minimizes interference and enhances the integration of OLED panels in portable devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If OLED display devices are used to reduce thickness and weight, then portability is improved, but integration and miniaturization become more challenging
Solution Approach 1:
The patent merges the display panel and circuit board into a single integrated structure where the circuit board is positioned in the same plane as the display panel. This integration eliminates the need for separate mounting structures and reduces overall device complexity while maintaining the weight benefits of OLED technology.
Solution Approach 2:
The patent transitions from a traditional three-dimensional stacked arrangement to a two-dimensional planar integration where the circuit board lies in the same plane as the display panel. This dimensional change enables more efficient space utilization and simplifies the integration process for miniaturized OLED devices.
2Reliability
If panel bumps are arranged in multiple rows to improve electrical connectivity, then connectivity is improved, but interference between adjacent bumps increases
Solution Approach 1:
The patent applies different properties to different parts of the bonding leads. Specifically, the portion of the bonding lead adjacent to second panel bumps has a different thickness than other portions, allowing for optimized electrical characteristics in high-interference regions while maintaining standard thickness elsewhere for overall connectivity reliability.
Solution Approach 2:
The patent changes the physical parameter of the bonding lead thickness in specific regions. By making the bonding lead thickness variable - thinner adjacent to second panel bumps and thicker in other regions - the patent optimizes electrical performance to reduce interference while maintaining reliable connectivity across all bump arrangements.
3Reliability
If bonding leads are made thicker to reduce electrical resistance, then electrical conductivity is improved, but device thickness increases
Solution Approach 1:
The patent implements non-uniform bonding lead thickness where specific portions adjacent to second panel bumps are made thinner than other portions. This local differentiation allows the bonding leads to maintain adequate conductivity where needed while minimizing overall thickness contribution to the device structure.
Solution Approach 2:
The patent varies the thickness parameter of the bonding leads along their length rather than maintaining a constant thickness. This parameter change enables optimization of electrical conductivity in critical regions while controlling the overall thickness profile to meet device form factor requirements.
Data Source
AI summary
A display device includes a display panel including panel bumps, a flexible circuit film connected to the display panel and including a chip, and panel bonding leads connecting the display panel to the chip. The panel bumps include first panel bumps arranged along a first row, and second panel bumps arranged along a second row which is spaced apart from the first row toward the chip. Each second panel bump is disposed between two adjacent first panel bumps when viewed from a column direction perpendicular to a row direction. The panel bonding leads includes first panel bonding leads connected to the first panel bumps and second panel bonding leads connected to the second panel bumps. Each first panel bonding lead includes a first portion having a first thickness, and a second portion adjacent to the second panel bump having a second thickness smaller than the first thickness.