Variable Capacitor Testing via Forward-Bias Light and Thermal Detection

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Solution Overview

Problem

Existing electronic devices with variable capacitors bonded on a substrate face high test difficulty, making it challenging to identify and repair individual failed components during the manufacturing process.

Innovation Solution

A manufacturing method that involves applying a reverse bias to electronic components on a substrate, determining their functionality by observing light emission or thermal characteristics, and using test pads to connect them in series or parallel with other components to apply forward bias, allowing for real-time failure detection and repair.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If reverse bias test is performed on variable capacitors after bonding to substrate, then component functionality can be tested, but test difficulty is high and single failed component cannot be located

Engineering Contradiction:
Improvecomponent functionality testVSAvoidtest difficulty
Core Design Contradiction:
ReliabilityVSDifficulty of detecting and measuring

Solution Approach 1:

The patent segments the testing process by electrically isolating individual variable capacitors using switch circuits. Each capacitor can be tested independently through its dedicated switch, allowing failure location to be identified at the component level rather than testing the entire array as a single unit. This segmentation transforms the undifferentiated high-difficulty test into multiple simple, locatable component tests.

Inventive Principle:
Principle #1Segmentation

2Reliability

If product function test is performed after bonding multiple variable capacitors to substrate, then overall device functionality is tested, but cannot locate a single failed variable capacitor

Engineering Contradiction:
Improvedevice functionality testVSAvoidfailure location identification
Core Design Contradiction:
ReliabilityVSEase of repair

Solution Approach 1:

The patent performs preliminary testing of individual variable capacitors before final device assembly using the switch circuit array. By testing each capacitor independently in its dedicated circuit region before bonding to the final substrate, failures are identified and located early in the manufacturing process. This preliminary action prevents the need to disassemble finished devices for failure location, greatly improving ease of repair.

Inventive Principle:
Principle #10Preliminary action

3Ease of repair

If individual variable capacitor testing is implemented during manufacturing, then failed components can be located, but test process complexity increases

Engineering Contradiction:
Improvefailed component locationVSAvoidtest process complexity
Core Design Contradiction:
Ease of repairVSDevice complexity

Solution Approach 1:

The patent merges the testing function into the existing manufacturing process by integrating switch circuits and test signal generation into the standard production flow. The test process uses the same bonding equipment and substrate structures, combining multiple functions (bonding, switching, signaling, and measurement) into a unified manufacturing system rather than adding separate complex test equipment.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables accurate and convenient identification of failed components during manufacturing, improving yield by allowing for immediate repair and ensuring only functional components proceed to the next production stage.

Implementation Method 1

Whether the at least one electronic component is normal or failed is determined based on a light emitted by the another electronic component

Methodology Applied
Scientific EffectLight emission: Electroluminescence

Implementation Method 2

Whether the at least one electronic component is normal or failed is determined according to a thermal characteristics of the at least one electronic component

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS20240381540A1Manufacturing method of electronic device
Publication Date: 2024.11.14 INNOLUX CORP
  • US20240381540A1 patent drawing
  • US20240381540A1 patent drawing
  • US20240381540A1 patent drawing

AI summary

A manufacturing method of an electronic device is provided. The manufacturing method of the electronic device includes following steps: providing a substrate; bonding an electronic component to the substrate, wherein the electronic component is mainly driven by a reverse bias in an operating mode, and the electronic component is electrically connected in series with another electronic component; applying a forward bias to the electronic component, and determining whether the electronic component is normal or failed based on a light emitted by the another electronic component or thermal characteristics of the electronic component; and transporting the substrate configured with the electronic component determined to be normal to a next production site or repairing the electronic component determined to be failed.