Variable Conductance Gas Distribution for Rapid Purging
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Solution Overview
Problem
Gas-phase reactors face slow substrate throughput and high processing costs due to long purging times, as they are designed to optimize reactant flow rates and residence times, restricting gas flow during purge steps.
Innovation Solution
A variable conductance gas distribution system that includes a mechanism to adjust gas flow by moving interlocking members, allowing for increased conductance during purging and reduced conductance during reactant introduction, using components like servo motors or pneumatic actuators to control gas flow rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If gas flow is restricted to optimize reactant flow rates and residence times, then film deposition rates and uniformity are improved, but purging time increases
Solution Approach 1:
The gas distribution system employs adjustable flow control members that can dynamically change the conductance of gas flow paths. During reactant introduction, the system restricts flow to optimize residence time and deposition uniformity. During purge steps, the flow control members adjust to increase conductance, enabling rapid removal of reactants and products without compromising deposition quality.
Solution Approach 2:
The system changes the physical parameter of gas flow conductance based on process requirements. By adjusting the position of flow control members, the system varies the effective cross-sectional area for gas flow, thereby changing flow rates and residence times. This parameter adjustment allows optimization of both deposition uniformity and purging speed at different process stages.
2Productivity
If gas flow is restricted to optimize reactant residence times, then desired film deposition rates are achieved, but substrate throughput decreases
Solution Approach 1:
The variable conductance gas distribution system dynamically adjusts flow paths using movable control members. During deposition cycles, the system maintains restricted flow for optimal reactant residence time and film quality. During purge cycles, the control members reposition to create more open flow paths, significantly reducing purging time and increasing overall substrate throughput.
Solution Approach 2:
The system employs periodic adjustment of gas flow conductance that corresponds to the cyclic nature of ALD processes. Flow control members are adjusted periodically between restricted (during reactant introduction) and open (during purge) states, optimizing both deposition quality and processing speed through rhythmic adaptation to process requirements.
Data Source
AI summary
Variable conductance gas distribution systems, reactors and systems including the variable conductance gas distribution systems, and methods of using the variable conductance gas distribution systems, reactors, and systems are disclosed. The variable conductance gas distribution systems allow rapid manipulation of gas-flow conductance through the gas distribution system.