Variable Conductance Valves for Station Uniformity
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Solution Overview
Problem
In semiconductor device formation systems where multiple stations share a gas source, achieving uniformity between processing stations is challenging due to differences in gas flow resistance, chamber volumes, powers, and temperatures, leading to nonuniform processing of substrates.
Innovation Solution
The implementation of a system with variable conductance valves connected between gas sources and processing stations' gas outlets, allowing for adjustable gas flow resistance to improve uniformity between stations, including the use of mixing manifolds and multiple gas sources to fine-tune gas delivery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If multiple processing stations share a common gas source, then system complexity and cost are reduced, but station-to-station uniformity deteriorates due to differences in gas flow resistance, chamber volumes, powers, and temperatures
Solution Approach 1:
The patent introduces individual variable conductance valves at each processing station to locally adjust gas flow resistance. This allows each station to have customized gas delivery characteristics tailored to its specific chamber volume, power, and temperature conditions, while still sharing the common gas source infrastructure.
Solution Approach 2:
The patent employs dynamically adjustable variable conductance valves that can be tuned in real-time to compensate for differences between stations. This dynamic adjustment capability enables the system to adapt to varying processing conditions and maintain uniformity across stations despite their inherent differences.
2Manufacturing precision
If variable conductance valves are added to each gas manifold, then station-to-station uniformity is improved through adjustable gas flow resistance, but device complexity increases
Solution Approach 1:
The patent changes the conductance parameter of the gas delivery system by introducing variable conductance valves. These valves allow precise control over gas flow resistance, enabling each station to be tuned to achieve optimal and uniform processing conditions despite differences in chamber characteristics.
Solution Approach 2:
The patent segments the common gas delivery system into station-specific branches, each with its own variable conductance valve. This segmentation allows independent control of gas flow to each processing station while maintaining the benefits of a shared gas source infrastructure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables improved station-to-station uniformity in substrate processing by adjusting gas flow rates, compensating for differences in processing chambers and equipment, resulting in more consistent results across multiple stations sharing a common gas source.
Implementation Method 1
A first variable conductance valve is between the first gas source and the first gas outlet along the first gas manifold. A second variable conductance valve is between the first gas source and the second gas outlet along the second gas manifold.
Data Source
AI summary
An apparatus for processing stacks is provided. A first gas source is provided. A first gas manifold is connected to the first gas source. A first processing station has a first gas outlet, wherein the first gas outlet is connected to the first gas manifold. A first variable conductance valve is between the first gas source and the first gas outlet along the first gas manifold.