Variable Conductor Design for 3DIC Cold Joint and Bridging
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Solution Overview
Problem
Three-Dimensional Integrated Circuits (3DICs) face challenges with cold joint and bridging issues due to warpage and other reasons, which existing technologies have not effectively addressed.
Innovation Solution
The solution involves forming two types of conductors with different volumes and widths at different regions of a substrate, where the second conductor has a larger height and is configured to alleviate cold joint issues, and the first conductor with a smaller height is used to prevent bridging, by strategically placing them in specific zones during the manufacturing of semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conductors with uniform dimensions are used across all regions, then manufacturing process is simple, but cold joint and bridging issues occur due to warpage
Solution Approach 1:
The patent applies local quality by varying conductor dimensions based on location. Conductors in first regions (prone to bridging) have smaller dimensions, while conductors in second regions (prone to cold joint) have larger dimensions. This localized adaptation resolves the contradiction by optimizing each region's conductor properties to address specific bonding issues without requiring complex manufacturing changes across the entire substrate.
Solution Approach 2:
The patent changes physical parameters of conductors (width, height, volume) based on regional requirements. By adjusting conductor volume and dimensions as parameters, the invention addresses both cold joint and bridging issues while maintaining a relatively simple manufacturing process that only requires variable parameter control rather than fundamentally different manufacturing approaches.
2Reliability
If conductor volume is increased to prevent cold joint, then bonding reliability improves, but bridging risk increases
Solution Approach 1:
The patent resolves this contradiction by applying local quality - different conductor volumes are assigned to different regions based on their specific risks. First regions have conductors with smaller volumes to prevent bridging, while second regions have conductors with larger volumes to prevent cold joint. This spatial differentiation allows the system to address both harmful factors simultaneously without compromising bonding reliability or increasing bridging risk.
Solution Approach 2:
The patent segments the substrate into multiple regions (first regions and second regions) with different conductor characteristics. This segmentation allows independent optimization of conductor volume for each region's specific needs, resolving the contradiction between preventing cold joint (requiring larger volume) and preventing bridging (requiring smaller volume) by treating them as separate localized problems rather than conflicting global requirements.
3Object-affected harmful factors
If conductor volume is decreased to prevent bridging, then bridging risk reduces, but cold joint issues worsen
Solution Approach 1:
The patent applies local quality by making conductor properties location-dependent. In first regions where bridging is the primary concern, smaller conductor volumes are used. In second regions where cold joint is the primary concern, larger conductor volumes are used. This resolves the contradiction by ensuring that the harmful factor being addressed (bridging or cold joint) is localized to specific regions, and the conductor design optimally addresses each region's dominant issue without compromising overall bonding reliability.
Data Source
AI summary
A semiconductor device includes an electronic component, a package, a substrate and a plurality of first conductors and second conductors. The package is over the electronic component. T substrate is between the electronic component and the package. The substrate includes a first portion covered by the package, and a second portion protruding out of an edge of the package and uncovered by the package. The first conductors and second conductors are between and electrically connected to the electronic component and the substrate. A width of a second conductor of the plurality of second conductors is larger than a width of a first conductor of the plurality of first conductors, the first conductors are disposed between the second portion of the substrate and the electronic component, and the second conductors are disposed between the first portion of the substrate and the electronic component.