Variable Cut Files for Package Design Adaptation

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Solution Overview

Problem

Existing automated package customization systems lack the ability to efficiently create variable cut and fold line definitions that adapt to different substrate thicknesses and application scenarios, such as moving from proof to production runs, which affects the accuracy and functionality of the final three-dimensional package structure.

Innovation Solution

A system that generates a package design file with variable cut and fold line definitions, including alternate parameters for different cutting and folding scenarios based on substrate thickness and application conditions, allowing for dynamic adjustments between proof and production runs, and enabling the creation of package flats that can be converted into three-dimensional structures using a cutting and/or folding device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a single cut file is used for all applications, then the system is simple to operate, but it cannot adapt to different substrate thicknesses and application scenarios

Engineering Contradiction:
Improveadaptability to different substrate thicknesses and application scenariosVSAvoidcomplexity of cut file structure
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent segments the cut file into multiple independent cut line definitions, each with its own parameters and alternate parameters. This allows the system to selectively apply different cut parameters for different scenarios (proof run vs. production run, different substrate thicknesses) without requiring a completely different cut file for each case.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces dynamic parameter selection where cut line definitions include both primary parameters and alternate parameters. The system dynamically selects which parameters to use based on detected conditions such as substrate thickness and application scenario, making the cut file adaptable without being overly complex.

Inventive Principle:
Principle #15Dynamics

2Adaptability or versatility

If alternate parameters are included for all cut lines, then the system can handle all scenarios, but the file size and processing time increase

Engineering Contradiction:
Improvecoverage of all cutting and folding scenariosVSAvoidtime to process and select parameters
Core Design Contradiction:
Adaptability or versatilityVSLoss of time

Solution Approach 1:

The patent applies local quality by allowing only specific cut line definitions to have alternate parameters when needed, rather than requiring all cut lines to have alternate parameters. This reduces file complexity and processing time while still providing adaptability where required.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The system performs preliminary action by pre-defining alternate parameters and their associated scenarios in the cut file. When processing begins, the system can quickly detect the appropriate scenario and select the corresponding parameters without requiring complex real-time calculations or adjustments.

Inventive Principle:
Principle #10Preliminary action

3Manufacturing precision

If the system detects device conditions and selects scenarios dynamically, then the accuracy of the package structure improves, but the system complexity increases

Engineering Contradiction:
Improveaccuracy of cut and fold linesVSAvoidcomplexity of parameter selection system
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent implements feedback by having the system detect actual device conditions (such as substrate thickness) and use this feedback to select the appropriate cut scenario and parameters. This ensures manufacturing precision while keeping the complexity manageable through rule-based selection rather than complex algorithms.

Inventive Principle:
Principle #23Feedback

Data Source

PatentUS10540453B2Creation of variable cut files for package design
Publication Date: 2020.01.21 GENESEE VALLEY INNOVATIONS LLC
  • US10540453B2 patent drawing
  • US10540453B2 patent drawing
  • US10540453B2 patent drawing

AI summary

A package design system uses a package design file to cause a cutting device to create a package. The file includes comprises a two-dimensional representation of a three-dimensional structure having a plurality of facets having alternative design scenarios that can be selected based on conditions of the cutting and/or folding device that is used to create the package. An example of such a condition is a thickness of a substrate that is being processed by the device. The system creates the file by creating a set of cut and/or fold line definitions. At least one of the cut and/or fold line definitions will be a variable cut/fold line definition. For each identified variable cut/fold line definition, the system identifies one or more alternate parameters for the variable cut/fold line definition, a first cutting/folding scenario that will not use the alternate parameters, and a second cutting/folding scenario that will use the alternate parameters.