Variable Depth Edge Ring for Etch Uniformity

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Solution Overview

Problem

Substrate processing systems face challenges in achieving uniform etch rates due to fixed pocket depths, which require manual adjustment of edge rings, limiting flexibility in varying process parameters and recipes.

Innovation Solution

A substrate support system with a controller that adjusts the pocket depth by raising or lowering the edge ring and inner portion using actuators, allowing for variable pocket depths based on desired process parameters, thereby modifying gas velocity profiles and improving etch uniformity without manual edge ring replacement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If manual adjustment of edge rings is used, then etch uniformity can be controlled, but processing flexibility and efficiency deteriorate due to inability to quickly vary pocket depths for different recipes

Engineering Contradiction:

Improveprocessing flexibilityVSAvoidetch uniformity

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent applies the dynamics principle by transforming the static, manually-adjustable edge ring into a dynamic, motor-driven adjustable mechanism. The edge ring is coupled with a motor that can automatically adjust its position to vary the pocket depth, enabling quick adaptation to different recipes while maintaining precise control over etch uniformity through automated positioning.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The patent implements parameter changes by enabling continuous variation of the pocket depth parameter through motor-driven adjustment of the edge ring position. This allows the system to change the geometric parameter (pocket depth) dynamically based on process requirements, improving adaptability while maintaining manufacturing precision through controlled adjustment.

Inventive Principle:

Principle #35Parameter changes

2Manufacturing precision

If fixed pocket depth is used, then device complexity is reduced, but etch rate uniformity deteriorates when varying process parameters

Engineering Contradiction:

Improveetch rate uniformityVSAvoiddevice complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies universality by designing a multi-functional substrate support system that can perform both simple support and dynamic pocket depth adjustment functions. The motor-driven edge ring mechanism serves multiple purposes: maintaining plasma confinement, protecting from erosion, and dynamically adjusting pocket depth for different recipes, thereby improving etch uniformity without proportionally increasing device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The system implements self-service through automated motor-driven adjustment of the edge ring position. The motor automatically positions the edge ring to achieve the desired pocket depth based on process parameters, eliminating the need for manual intervention and reducing operational complexity while maintaining precise etch uniformity control.

Inventive Principle:

Principle #25Self-service

3Productivity

If manual edge ring replacement is used, then manufacturing simplicity is maintained, but productivity deteriorates due to time-consuming adjustments

Engineering Contradiction:

Improveprocessing efficiencyVSAvoidmanufacturing simplicity

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The patent replaces the manual mechanical adjustment system with an automated motor-driven system. The motor substitutes for manual mechanical operations, automatically adjusting the edge ring position to vary pocket depth, thereby significantly improving processing efficiency while the overall manufacturing approach remains relatively simple and maintainable.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS11342163B2Variable depth edge ring for etch uniformity control

Publication Date: 2022.05.24 LAM RES CORP

AI summary

A method of operating a substrate support includes arranging a substrate on an inner portion of the substrate support and calculating a desired pocket depth of the substrate support using data indicative of a relationship between the desired pocket depth and at least one process parameter. The desired pocket depth corresponds to a desired distance between an upper surface of an edge ring surrounding the inner portion and an upper surface of the substrate. The method further includes selectively controlling, based on the desired pocket depth as calculated, an actuator to raise and lower at least one of the edge ring and the inner portion to adjust the distance between the upper surface of the edge ring and the upper surface of the substrate.