Variable Dummy Pattern Filling for DR Accuracy

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Solution Overview

Problem

Existing IC fabrication processes face challenges in maintaining consistent Data Ratio (DR) of patterns, leading to Critical Dimension (CD) deviations and performance failures, particularly due to limitations in fixed dummy pattern filling methods which cannot always achieve the required DR values across different layouts and etching processes.

Innovation Solution

An intelligent dummy pattern filling method that determines the rule of filling based on required DR values and isolation rules, adjusting sizes, shapes, and pitches of dummy patterns to match them with empty areas, ensuring the DR values of filled patterns closely match the required values and adhere to isolation rules, thereby allowing for a unified etching process across different layouts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If fixed dummy pattern filling is used to meet DR requirements, then the DR correction is achieved to a certain extent, but the DR value cannot close to the required value and CD deviation remains due to different layouts and wiring

Engineering Contradiction:

ImproveDR value accuracyVSAvoidCD deviation

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The patent transitions from fixed dummy pattern filling to variable dummy pattern filling, where the size, shape, and pitch of dummy patterns are dynamically adjusted based on the specific layout and required DR value. This allows the DR value to closely match the required value for different layouts, thereby reducing CD deviation and improving both DR accuracy and etching reliability.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The patent changes the parameters of dummy patterns (size, shape, pitch) to optimize the DR value for each specific layout. By varying these parameters, the system can achieve the required DR value more accurately across different products and layouts, reducing CD deviation without requiring multiple etching menus.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If different etching menus are developed for different DRs to overcome CD deviation, then the CD deviation arising from DR difference is reduced, but the delivery time is directly affected and difficulties in managing numerous process menus arise

Engineering Contradiction:

ImproveCD deviation controlVSAvoiddelivery time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent creates a universal dummy pattern filling method that can handle different layouts and DR requirements using a single etching menu. By making the dummy pattern filling adaptable to various scenarios through variable parameters, the system eliminates the need for multiple specialized etching menus, thereby reducing delivery time and simplifying process management while maintaining CD deviation control.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Ease of manufacture

If fixed dummy patterns are filled according to isolation rules, then the isolation rules are satisfied, but some Fields cannot be filled with any dummy patterns and large areas remain unfilled

Engineering Contradiction:

Improveisolation rule satisfactionVSAvoidunfilled area

Core Design Contradiction:

Ease of manufactureVSArea of stationary object

Solution Approach 1:

The patent employs variable dummy patterns that can adapt their size, shape, and position to fit within the constraints of isolation rules while maximizing the filled area. This dynamic adjustment allows dummy patterns to be placed in areas where fixed patterns would violate isolation rules, thereby reducing the unfilled area while still satisfying manufacturing constraints.

Inventive Principle:

Principle #15Dynamics

4Ease of operation

If fixed dummy patterns with same length and breadth are used, then the filling process is simple, but the DR value cannot be optimized for different layouts and products

Engineering Contradiction:

Improvefilling process simplicityVSAvoidDR value optimization

Core Design Contradiction:

Ease of operationVSManufacturing precision

Solution Approach 1:

The patent transitions from uniform fixed dummy patterns to variable dummy patterns where the size, shape, and pitch are adjusted based on the specific layout requirements. This dynamic approach maintains ease of operation through automated determination of optimal parameters while significantly improving DR value optimization for different layouts and products.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The patent varies the parameters of dummy patterns (length, breadth, pitch) to optimize DR values for different layouts. By changing these parameters based on layout characteristics, the system achieves better DR optimization while maintaining operational simplicity through automated parameter determination.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS10061884B2Dummy pattern filling method

Publication Date: 2018.08.28 SHANGHAI HUAHONG GRACE SEMICON MFG CORP

AI summary

A dummy pattern filling method, including: Step I, determining the rule of filling dummy patterns, in accordance with required DR values and isolation rules of patterns; Step II, finding out blank Fields within said layout that need to be filled with dummy patterns; Step III, by following said rule of filling dummy patterns, filling dummy patterns within blank Fields on layouts. Implementing a Smart Dummy Pattern Filling, which enables the Data Ratio (DR) of dummy patterns to come infinitely close the required DR value after completing the filling of dummy patterns.