Variable Cross-Section Features Using Molded Cavity Deposition
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Solution Overview
Problem
Conventional methods for forming features on substrates of electrical and optical devices result in uniform cross-sectional shapes, sizes, and positions, limiting the potential for diverse and optimized component designs.
Innovation Solution
A method involving forming cavities in a mold layer on a substrate, applying feature material within these cavities, and removing the mold layer to create features with varying cross-sectional shapes, sizes, or positions, using techniques like conformal chemical vapor deposition and etching processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional methods are used to form features on a substrate, then the manufacturing process is simple and uniform, but the features have uniform cross-sectional shapes, sizes, and positions which limits design versatility
Solution Approach 1:
The patent applies preliminary action by forming cavities in a mold layer before depositing the feature material. The cavities are pre-formed with varying cross-sectional shapes, sizes, and positions, which then guide the conformal deposition process to create features with the desired non-uniform geometries. This preliminary structuring of the mold layer enables design versatility while maintaining a systematic manufacturing approach.
Solution Approach 2:
The mold layer acts as an intermediary element between the substrate and the final feature structure. By forming cavities in this intermediate mold layer with specific geometries, the patent enables the transfer of complex varying cross-sectional shapes to the feature material through conformal deposition. The mold layer mediates the transformation from simple deposition processes to complex feature geometries.
2Manufacturing precision
If conventional uniform feature formation is used, then the manufacturing precision is easy to control, but the features lack varying cross-sectional shapes and sizes needed for optimized performance
Solution Approach 1:
The patent applies local quality by creating cavities in the mold layer with spatially varying cross-sectional shapes, sizes, and positions. Each cavity can have different geometrical characteristics tailored to specific locations on the substrate. When feature material is conformally deposited, it inherits these local variations, producing features with precisely controlled non-uniform geometries that optimize performance for different regions.
Solution Approach 2:
The patent transitions from two-dimensional uniform feature patterns to three-dimensional features with varying cross-sectional geometries. By introducing depth variations and shape changes along the vertical dimension through the mold layer cavities, the patent enables features to have complex out-of-plane profiles while maintaining precise control over their three-dimensional shapes and positions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the fabrication of components with non-uniform features, enhancing the functionality and performance of electrical and optical devices by allowing for tailored designs with varying dimensions and positions.
Implementation Method 1
applying the feature material within each of the at least one cavity and on the substrate. The feature material may define the at least one feature... applying the feature material within each of the at least one cavity includes using a conformal chemical vapor deposition process to apply the feature material
Implementation Method 2
forming the at least one cavity in the mold layer includes removing a portion of the mold material with a wet chemical etching process to form the at least one cavity... removing the portion of the mold material includes removing the portion of the mold material with potassium hydroxide (KOH)
Implementation Method 3
forming the at least one cavity in the mold layer includes removing a portion of the mold material with a dry etching process to form the at least one cavity... the dry etching process results in reduced etching as the portion of the mold material is removed, which results in a tapered shape
Implementation Method 4
forming the at least one cavity in the mold layer includes removing a portion of the mold material with a reactive ion etching process to form the at least one cavity
Data Source
AI summary
In various aspects, a method of forming at least one feature on a substrate for a component of an electrical or optical device is provided. The method may include forming at least one cavity in a mold layer that is on the substrate. The mold layer may include a mold material. The method may include applying a feature material within each of the at least one cavity and on the substrate. The feature material may define the at least one feature.


