Variable-Fin Liquid Cooler for Uniform EV Power Module Heat Dissipation
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Solution Overview
Problem
Existing liquid-cooling coolers for electric vehicle power modules are inadequate in meeting the increasing heat-dissipation requirements due to the growing number of chips and heat sources in EV power modules.
Innovation Solution
A liquid-cooling cooler with varying fin density regions, including high-density and low-density fin regions adjacent to the inlet and outlet ends, and a chamber formed by a plate and cover, made of copper or copper alloy, to enhance heat dissipation uniformity and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If existing liquid-cooling coolers are used for EV power modules, then the structure is simple and easy to manufacture, but the heat dissipation capability is insufficient for multiple chips and regions
Solution Approach 1:
The patent applies local quality by dividing the cooler into multiple fin regions with different fin densities matched to different heat source densities. High-density fin regions are positioned under high-power chips that generate more heat, while low-density fin regions are positioned under lower-power chips. This localized optimization of heat dissipation structure enables the cooler to effectively handle multiple heat sources with varying thermal loads, resolving the contradiction between heat dissipation capability and structural complexity.
2Temperature
If uniform fin density is used across the cooler, then the structure is simple, but the heat dissipation uniformity across multiple heat sources is poor
Solution Approach 1:
The patent implements local quality by creating non-uniform fin density distribution across different regions of the cooler. Each fin region is designed with specific fin density, fin height, and fin spacing optimized for the thermal characteristics of the underlying heat source. This localized customization of geometric parameters achieves uniform heat dissipation across multiple heat sources with different power densities, resolving the contradiction between temperature uniformity and structural complexity.
Solution Approach 2:
The patent applies segmentation by dividing the cooler into multiple discrete fin regions, each independently optimized for its specific heat source. The cooler is segmented into high-density fin regions for high-power chips and low-density fin regions for lower-power chips, with clear boundaries between regions. This segmentation strategy enables independent optimization of each region's thermal performance, achieving overall heat dissipation uniformity while managing the complexity through modular region design.
3Loss of energy
If high-density fins are used throughout, then heat dissipation efficiency increases, but the cooler cannot effectively cool multiple heat sources with different power densities
Solution Approach 1:
The patent resolves this contradiction by applying local quality through spatially varying fin density. High-density fin regions are strategically positioned under high-power heat sources to maximize heat dissipation efficiency where needed, while low-density fin regions are positioned under lower-power heat sources to prevent overheating. This localized optimization enables the cooler to effectively adapt to multiple heat sources with different power densities, achieving both high heat dissipation efficiency and versatility.
Solution Approach 2:
The patent applies dynamics by creating a adaptable fin structure that can be configured to match different heat source distributions. The cooler design allows for dynamic adjustment of fin density distribution to accommodate varying thermal loads across different operating conditions and chip configurations, enhancing adaptability to multiple heat sources while maintaining high heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves uniform heat dissipation across multiple heat sources, improving the overall heat dissipation temperature and efficiency of the electric vehicle power module.
Implementation Method 1
The liquid-cooling cooler includes an inlet end, an outlet end, and a chamber connected to the inlet end and the outlet end... adapted for contacting multiple heat sources of the electric vehicle power module
Implementation Method 2
A plurality of fin regions arranged in a water flow direction are located within the chamber... to enhance heat dissipation uniformity and efficiency
Data Source
AI summary
A liquid-cooling cooler for an electric vehicle power module includes an inlet end, an outlet end, and a chamber connected to the inlet end and the outlet end. A plurality of fin regions arranged in a water flow direction are located within the chamber. The plurality of fin regions include at least one high-density fin region, such that at least one low-density and inlet-end-adjacent fin region is more adjacent to the inlet end and is of lower density than the at least one high-density fin region, and at least one low-density and outlet-end-adjacent fin region is more adjacent to the outlet end and is of lower density than the at least one high-density fin region. The plurality of fin regions include at least one low-density fin region.